Osamu Yamazaki

Person

Hiroshima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Device generating sound
- Patent number 9,743,166
- Issue date Aug 22, 2017
- TOKIN CORPORATION
- Yoshiyuki Abe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 9,562,179
- Issue date Feb 7, 2017
- Lintec Corporation
- Naoya Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 9,184,082
- Issue date Nov 10, 2015
- Lintec Corporation
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for manufacturing semiconductor devices
- Patent number 8,545,663
- Issue date Oct 1, 2013
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distance measuring device and method, and computer program
- Patent number 8,331,625
- Issue date Dec 11, 2012
- Pioneer Corporation
- Osamu Yamazaki
- G01 - MEASURING TESTING
Information Patent Grant
Separator for use in fuel cell and manufacturing method therefor
- Patent number 8,080,146
- Issue date Dec 20, 2011
- Toyota Jidosha Kabushiki Kaisha
- Yusuke Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor sealing resin sheet and semiconductor device manufact...
- Patent number 8,034,667
- Issue date Oct 11, 2011
- Lintec Corporation
- Tomonori Shinoda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,003,441
- Issue date Aug 23, 2011
- Lintec Corporation
- Jun Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 7,842,551
- Issue date Nov 30, 2010
- Lintec Corporation
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sheet to form a protective film for chips
- Patent number 7,408,259
- Issue date Aug 5, 2008
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor chips having a protective film...
- Patent number 7,235,465
- Issue date Jun 26, 2007
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor device
- Patent number 7,169,648
- Issue date Jan 30, 2007
- Lintec Corporation
- Akinori Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Navigation apparatus, navigation method, route data creation progra...
- Patent number 7,136,749
- Issue date Nov 14, 2006
- Pioneer Corporation
- Naohiko Ichihara
- G01 - MEASURING TESTING
Information Patent Grant
Adhesive tape
- Patent number 7,135,224
- Issue date Nov 14, 2006
- Lintec Corporation
- Takaji Sumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Communicating apparatus and communicating method
- Patent number 7,046,698
- Issue date May 16, 2006
- Pioneer Corporation
- Manabu Nohara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Play back apparatus
- Patent number 7,043,440
- Issue date May 9, 2006
- Pioneer Corporation
- Takehiko Shioda
- G11 - INFORMATION STORAGE
Information Patent Grant
Mobile communication system with mobile station position detection
- Patent number 6,980,814
- Issue date Dec 27, 2005
- Pioneer Corporation
- Manabu Nohara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing semiconductor device using adhesive sheet...
- Patent number 6,977,024
- Issue date Dec 20, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip carrying adhesive tape/sheet, semiconductor chip...
- Patent number 6,924,211
- Issue date Aug 2, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor chips
- Patent number 6,919,262
- Issue date Jul 19, 2005
- Lintec Corporation
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device adhesive sheet with conductor bodies buried th...
- Patent number 6,911,720
- Issue date Jun 28, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including adhesive agent layer with embedded c...
- Patent number 6,900,550
- Issue date May 31, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape for forming resin tie bar, resin tie bar, lead frame equipped...
- Patent number 6,855,418
- Issue date Feb 15, 2005
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for mobile communication
- Patent number 6,813,508
- Issue date Nov 2, 2004
- Pioneer Corporation
- Takehiko Shioda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor chip carrying adhesive tape/sheet, semiconductor chip...
- Patent number 6,753,614
- Issue date Jun 22, 2004
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiving device for spread spectrum communication system
- Patent number 6,731,675
- Issue date May 4, 2004
- Pioneer Corporation
- Manabu Nohara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Code error correcting circuit, code error correcting method, commun...
- Patent number 6,701,468
- Issue date Mar 2, 2004
- Pioneer Corporation
- Osamu Yamazaki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Communication apparatus and communication method
- Patent number 6,546,258
- Issue date Apr 8, 2003
- Pioneer Corporation
- Manabu Nohara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pressure sensitive adhesive sheet for wafer sticking
- Patent number 6,524,700
- Issue date Feb 25, 2003
- NEC Corporation
- Yasushi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device comprising titanium
- Patent number 5,312,774
- Issue date May 17, 1994
- Sharp Kabushiki Kaisha
- Kazuyo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOUND GENERATING UNIT AND ELECTRONIC DEVICE
- Publication number 20170257706
- Publication date Sep 7, 2017
- TOKIN CORPORATION
- Osamu YAMAZAKI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DEVICE GENERATING SOUND
- Publication number 20160249120
- Publication date Aug 25, 2016
- NEC TOKIN CORPORATION
- Yoshiyuki ABE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Adhesive Composition, Adhesive Sheet And Production Process For Sem...
- Publication number 20160017188
- Publication date Jan 21, 2016
- LINTEC CORPORATION
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Separator for Use in Fuel Cell and Manufacturing Method Therefor
- Publication number 20100233584
- Publication date Sep 16, 2010
- Yusuke Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Manufacturing Method of Semiconductor Device
- Publication number 20100190293
- Publication date Jul 29, 2010
- LINTEC CORPORATION
- Jun Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VEHICULAR IMAGE PROCESSING DEVICE, AND VEHICULAR IMAGE PROCESSING P...
- Publication number 20100007734
- Publication date Jan 14, 2010
- Pioneer Corporation
- Osamu Yamazaki
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD OF ADJUSTING DISPLAY DEVICE FOR VEHICLE AND DISPLAY DEVICE F...
- Publication number 20100001881
- Publication date Jan 7, 2010
- Pioneer Corporation
- Shinichi Sugie
- B60 - VEHICLES IN GENERAL
Information Patent Application
DISTANCE MEASURING DEVICE AND METHOD, AND COMPUTER PROGRAM
- Publication number 20090279740
- Publication date Nov 12, 2009
- Pioneer Corporation
- Osamu Yamazaki
- G01 - MEASURING TESTING
Information Patent Application
IMAGE CORRECTING DEVICE AND METHOD, AND COMPUTER PROGRAM
- Publication number 20090226094
- Publication date Sep 10, 2009
- Pioneer Corporation
- Osamu Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Adhesive Sheet for Dicing and Die Bonding
- Publication number 20090220783
- Publication date Sep 3, 2009
- Sharp Kabushiki Kaisha
- Yasuki Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Sheet-Like Underfill Material and Semiconductor Device Manufacturin...
- Publication number 20090075429
- Publication date Mar 19, 2009
- LINTEC CORPORATION
- Akinori Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sheet for Forming a Protective Film for Chips
- Publication number 20090053518
- Publication date Feb 26, 2009
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Sheet to Form a Protective Shield for Chips
- Publication number 20080260982
- Publication date Oct 23, 2008
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor De...
- Publication number 20080241995
- Publication date Oct 2, 2008
- SHARP KABUSHIKI KAISHA
- Yasuki Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for forming insulating film
- Publication number 20080160782
- Publication date Jul 3, 2008
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20080124839
- Publication date May 29, 2008
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for manufacturing process of semiconductor device
- Publication number 20080066856
- Publication date Mar 20, 2008
- LINTEC CORPORATION
- Osamu YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive composition, adhesive sheet and production process for sem...
- Publication number 20070276079
- Publication date Nov 29, 2007
- Lintec Corporation
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor Sealing Resin Sheet and Semiconductor Device Manufact...
- Publication number 20070254410
- Publication date Nov 1, 2007
- Lintec Corporation
- Tomonori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Navigation device, navigation method, route data generation program...
- Publication number 20060241862
- Publication date Oct 26, 2006
- Naohiko Ichihara
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and its fabrication method
- Publication number 20060211269
- Publication date Sep 21, 2006
- Sharp Kabushiki Kaisha
- Toshihisa Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hardenable pressure-sensitive adhesive sheet for semiconductor and...
- Publication number 20050208296
- Publication date Sep 22, 2005
- LINTEC CORPORATION
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for producing semiconductor chips having a protective film...
- Publication number 20050186762
- Publication date Aug 25, 2005
- LINTEC CORPORATION
- Hideo Senoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stainless steel plate, method of manufacturing the same, and rubber...
- Publication number 20050057004
- Publication date Mar 17, 2005
- NIPPON KINZOKU CO., LTD
- Osamu Yamazaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for producing a semiconductor device
- Publication number 20050037542
- Publication date Feb 17, 2005
- LINTEC CORPORATION
- Akinori Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Navigation apparatus, navigation method, route data creation progra...
- Publication number 20040260466
- Publication date Dec 23, 2004
- PIONEER CORPORATION
- Naohiko Ichihara
- G01 - MEASURING TESTING
Information Patent Application
Adhesive tape
- Publication number 20040232563
- Publication date Nov 25, 2004
- Takaji Sumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductor bodies attached adhesive sheet, process for producing sem...
- Publication number 20040012098
- Publication date Jan 22, 2004
- Osamu Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for manufacturing semiconductor device using adhesive sheet...
- Publication number 20030226640
- Publication date Dec 11, 2003
- Osamu Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor chip carrying adhesive tape/sheet, semiconductor chip...
- Publication number 20030140485
- Publication date Jul 31, 2003
- Osamu Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Osamu Yamazaki

Person

Patents Grantslast 30 patents

Device generating sound

Adhesive composition, adhesive sheet and production process for sem...

Adhesive composition, adhesive sheet and production process for sem...

Process for manufacturing semiconductor devices

Distance measuring device and method, and computer program

Separator for use in fuel cell and manufacturing method therefor

Semiconductor sealing resin sheet and semiconductor device manufact...

Manufacturing method of semiconductor device

Adhesive composition, adhesive sheet and production process for sem...

Sheet to form a protective film for chips

Process for producing semiconductor chips having a protective film...

Process for producing a semiconductor device

Navigation apparatus, navigation method, route data creation progra...

Adhesive tape

Communicating apparatus and communicating method

Play back apparatus

Mobile communication system with mobile station position detection

Method for manufacturing semiconductor device using adhesive sheet...

Semiconductor chip carrying adhesive tape/sheet, semiconductor chip...

Process for producing semiconductor chips

Semiconductor device adhesive sheet with conductor bodies buried th...

Semiconductor device including adhesive agent layer with embedded c...

Tape for forming resin tie bar, resin tie bar, lead frame equipped...

Apparatus and method for mobile communication

Semiconductor chip carrying adhesive tape/sheet, semiconductor chip...

Receiving device for spread spectrum communication system

Code error correcting circuit, code error correcting method, commun...

Communication apparatus and communication method

Pressure sensitive adhesive sheet for wafer sticking

Method for manufacturing a semiconductor device comprising titanium

Patents Applicationslast 30 patents

SOUND GENERATING UNIT AND ELECTRONIC DEVICE

DEVICE GENERATING SOUND

Adhesive Composition, Adhesive Sheet And Production Process For Sem...

Separator for Use in Fuel Cell and Manufacturing Method Therefor

Manufacturing Method of Semiconductor Device

VEHICULAR IMAGE PROCESSING DEVICE, AND VEHICULAR IMAGE PROCESSING P...

METHOD OF ADJUSTING DISPLAY DEVICE FOR VEHICLE AND DISPLAY DEVICE F...

DISTANCE MEASURING DEVICE AND METHOD, AND COMPUTER PROGRAM

IMAGE CORRECTING DEVICE AND METHOD, AND COMPUTER PROGRAM

Adhesive Sheet for Dicing and Die Bonding

Sheet-Like Underfill Material and Semiconductor Device Manufacturin...

Sheet for Forming a Protective Film for Chips

Sheet to Form a Protective Shield for Chips

Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor De...

Method for forming insulating film

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Process for manufacturing process of semiconductor device

Adhesive composition, adhesive sheet and production process for sem...

Semiconductor Sealing Resin Sheet and Semiconductor Device Manufact...

Navigation device, navigation method, route data generation program...

Semiconductor device and its fabrication method

Hardenable pressure-sensitive adhesive sheet for semiconductor and...

Process for producing semiconductor chips having a protective film...

Stainless steel plate, method of manufacturing the same, and rubber...

Process for producing a semiconductor device

Navigation apparatus, navigation method, route data creation progra...

Adhesive tape

Conductor bodies attached adhesive sheet, process for producing sem...

Method for manufacturing semiconductor device using adhesive sheet...

Semiconductor chip carrying adhesive tape/sheet, semiconductor chip...