Osamu Yokomizo

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Okayama-City, JP

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit chip bonding sheet and integrated circuit package
- Patent number 7,307,350
- Issue date Dec 11, 2007
- Japan Gore-Tex, Inc.
- Kazuhiko Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Intergrated circuit chip bonding sheet and integrated circuit package
- Publication number 20030020178
- Publication date Jan 30, 2003
- Kazuhiko Ohashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...