Osamu Yokoyama

Person

Sagamihara-Shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method, device, and system for etching silicon oxide film
- Patent number 11,626,290
- Issue date Apr 11, 2023
- Tokyo Electron Limited
- Osamu Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and recording medium
- Patent number 10,242,878
- Issue date Mar 26, 2019
- Tokyo Electron Limited
- Tomonari Urano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing Cu wiring
- Patent number 10,096,548
- Issue date Oct 9, 2018
- Tokyo Electron Limited
- Kenji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wiring forming method, film forming system, and storage medium
- Patent number 9,425,093
- Issue date Aug 23, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper wiring forming method with Ru liner and Cu alloy fill
- Patent number 9,406,557
- Issue date Aug 2, 2016
- Tokyo Electron Limited
- Osamu Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu wiring fabrication method and storage medium
- Patent number 9,406,558
- Issue date Aug 2, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper wiring
- Patent number 9,362,166
- Issue date Jun 7, 2016
- Tokyo Electron Limited
- Tadahiro Ishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 9,253,862
- Issue date Feb 2, 2016
- Tokyo Electron Limited
- Tatsuo Hirasawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming copper wiring and method and system for forming c...
- Patent number 8,859,422
- Issue date Oct 14, 2014
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming copper wiring and copper film, and film forming...
- Patent number 8,399,353
- Issue date Mar 19, 2013
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film formation method and film formation apparatus
- Patent number 8,277,889
- Issue date Oct 2, 2012
- Tokyo Electron Limited
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film deposition method and film deposition apparatus of metal film
- Patent number 8,029,873
- Issue date Oct 4, 2011
- Tokyo Electron Limited
- Taro Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film forming method, plasma film forming apparatus and storage medium
- Patent number 8,026,176
- Issue date Sep 27, 2011
- Tokyo Electron Limited
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma film forming method and plasma film forming apparatus
- Patent number 6,355,902
- Issue date Mar 12, 2002
- Tokyo Electron Limited
- Takashi Akahori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma film forming method and plasma film forming apparatus
- Patent number 6,215,087
- Issue date Apr 10, 2001
- Tokyo Electron Limited
- Takashi Akahori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20230094053
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- Yuichiro WAGATSUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, DEVICE, AND SYSTEM FOR ETCHING SILICON OXIDE FILM
- Publication number 20220051901
- Publication date Feb 17, 2022
- TOKYO ELECTRON LIMITED
- Osamu YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
- Publication number 20170250086
- Publication date Aug 31, 2017
- Tomonari URANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING Cu WIRING
- Publication number 20160276218
- Publication date Sep 22, 2016
- TOKYO ELECTRON LIMITED
- Kenji MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRING FORMING METHOD, FILM FORMING SYSTEM, AND STORAGE MEDIUM
- Publication number 20160163591
- Publication date Jun 9, 2016
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cu Wiring Fabrication Method and Storage Medium
- Publication number 20150332961
- Publication date Nov 19, 2015
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING
- Publication number 20150262872
- Publication date Sep 17, 2015
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Wiring Forming Method
- Publication number 20150004784
- Publication date Jan 1, 2015
- TOKYO ELECTRON LIMITED
- Osamu YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...
- Publication number 20140287163
- Publication date Sep 25, 2014
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20140090597
- Publication date Apr 3, 2014
- TOKYO ELECTRON LIMITED
- Tatsuo HIRASAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS AND CLEANING METHOD FOR REMOVING METAL...
- Publication number 20140060572
- Publication date Mar 6, 2014
- TOKYO ELECTRON LIMITED
- Chiaki YASUMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM FORMING METHOD
- Publication number 20130252417
- Publication date Sep 26, 2013
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20130237053
- Publication date Sep 12, 2013
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING Cu WIRING
- Publication number 20120222782
- Publication date Sep 6, 2012
- TOKYO ELECTRON LIMITED
- Atsushi Gomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...
- Publication number 20120196052
- Publication date Aug 2, 2012
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING...
- Publication number 20120196437
- Publication date Aug 2, 2012
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING CVD-RU FILM AND METHOD FOR MANUFACTURING SEMICON...
- Publication number 20120064717
- Publication date Mar 15, 2012
- TOKYO ELECTRON LIMITED
- Takara KATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film Forming Method, Plasma Film Forming Apparatus and Storage Medium
- Publication number 20100167540
- Publication date Jul 1, 2010
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMATION METHOD AND FILM FORMATION APPARATUS
- Publication number 20100075035
- Publication date Mar 25, 2010
- TOKYO ELECTRON LIMITED,
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS SUPPLY METHOD AND GAS SUPPLY DEVICE
- Publication number 20100062158
- Publication date Mar 11, 2010
- TOKYO ELECTRON LIMITED
- Masamichi Hara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film Deposition Method and Film Deposition Apparatus of Metal Film
- Publication number 20090227104
- Publication date Sep 10, 2009
- Taro Ikeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Seed Film Forming Method, Plasma-Assisted Film Forming System and S...
- Publication number 20090183984
- Publication date Jul 23, 2009
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film Deposition Method, Film Deposition Apparatus, and Storage Medium
- Publication number 20090087583
- Publication date Apr 2, 2009
- Takashi Sakuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Processing apparatus and cleaning method
- Publication number 20040065344
- Publication date Apr 8, 2004
- Shinsuke Oka
- B08 - CLEANING
Information Patent Application
Plasma film forming method and plasma film forming apparatus
- Publication number 20010020608
- Publication date Sep 13, 2001
- Takashi Akahori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Osamu Yokoyama

Person

Patents Grantslast 30 patents

Method, device, and system for etching silicon oxide film

Substrate processing method and recording medium

Method of manufacturing Cu wiring

Copper wiring forming method, film forming system, and storage medium

Copper wiring forming method with Ru liner and Cu alloy fill

Cu wiring fabrication method and storage medium

Method of forming copper wiring

Plasma processing method and plasma processing apparatus

Method of forming copper wiring and method and system for forming c...

Methods of forming copper wiring and copper film, and film forming...

Film formation method and film formation apparatus

Film deposition method and film deposition apparatus of metal film

Film forming method, plasma film forming apparatus and storage medium

Plasma film forming method and plasma film forming apparatus

Plasma film forming method and plasma film forming apparatus

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

METHOD, DEVICE, AND SYSTEM FOR ETCHING SILICON OXIDE FILM

SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM

METHOD OF MANUFACTURING Cu WIRING

COPPER WIRING FORMING METHOD, FILM FORMING SYSTEM, AND STORAGE MEDIUM

Cu Wiring Fabrication Method and Storage Medium

METHOD OF FORMING COPPER WIRING

Copper Wiring Forming Method

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS AND CLEANING METHOD FOR REMOVING METAL...

THIN FILM FORMING METHOD

FILM FORMING METHOD AND FILM FORMING APPARATUS

METHOD FOR FORMING Cu WIRING

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...

METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING...

METHOD FOR FORMING CVD-RU FILM AND METHOD FOR MANUFACTURING SEMICON...

Film Forming Method, Plasma Film Forming Apparatus and Storage Medium

FILM FORMATION METHOD AND FILM FORMATION APPARATUS

GAS SUPPLY METHOD AND GAS SUPPLY DEVICE

Film Deposition Method and Film Deposition Apparatus of Metal Film

Seed Film Forming Method, Plasma-Assisted Film Forming System and S...

Film Deposition Method, Film Deposition Apparatus, and Storage Medium

Processing apparatus and cleaning method

Plasma film forming method and plasma film forming apparatus