Oscar Torrents Abad

Person

Cork, IE

People

Patents Grantslast 30 patents

Information Patent Grant
Application of underfill via centrifugal force
- Patent number 11,677,051
- Issue date Jun 13, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating parabolic-shaped LEDs
- Patent number 10,840,418
- Issue date Nov 17, 2020
- Facebook Technologies, LLC
- David Massoubre
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER
- Publication number 20220393060
- Publication date Dec 8, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20220352412
- Publication date Nov 3, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER
- Publication number 20200395519
- Publication date Dec 17, 2020
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMPLOYING DEFORMABLE CONTACTS AND PRE-APPLIED UNDERFILL FOR BONDING...
- Publication number 20200395504
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Application
SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER
- Publication number 20200395521
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER
- Publication number 20200395503
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20200395520
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS

Oscar Torrents Abad

Person

Patents Grantslast 30 patents

Application of underfill via centrifugal force

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Display device and its process for curing post-applied underfill ma...

Dielectric-dielectric and metallization bonding via plasma activati...

Fabricating parabolic-shaped LEDs

Patents Applicationslast 30 patents

CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER

EMPLOYING DEFORMABLE CONTACTS AND PRE-APPLIED UNDERFILL FOR BONDING...

SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER

CURING PRE-APPLIED AND LASER-ABLATED UNDERFILL VIA A LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...