Oseob Jeon

Person

Bucheon City, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 11,961,782
- Issue date Apr 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 11,901,309
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies and methods of manufacture
- Patent number 11,521,921
- Issue date Dec 6, 2022
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a spacer with a junction cooling pipe
- Patent number 11,201,105
- Issue date Dec 14, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including a one-body clip
- Patent number 11,101,198
- Issue date Aug 24, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,037,907
- Issue date Jun 15, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices
- Patent number 11,031,379
- Issue date Jun 8, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having junction cooling pipes embedded in sub...
- Patent number 10,607,919
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,403,601
- Issue date Sep 3, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices and mo...
- Patent number 10,090,279
- Issue date Oct 2, 2018
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including a semiconductor die and a capacitive component
- Patent number 9,478,519
- Issue date Oct 25, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus related to an improved package including a semiconductor die
- Patent number 9,177,925
- Issue date Nov 3, 2015
- Fairfchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power module package having excellent heat sink emission capability...
- Patent number 8,890,310
- Issue date Nov 18, 2014
- Fairchild Korea Semiconductor, Ltd.
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level MOSFET metallization
- Patent number 8,866,218
- Issue date Oct 21, 2014
- Fairchild Semiconductor Corporation
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Vertical MOSFET transistor having source/drain contacts disposed on...
- Patent number 8,487,371
- Issue date Jul 16, 2013
- Fairchild Semiconductor Corporation
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 8,193,043
- Issue date Jun 5, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,183,088
- Issue date May 22, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 7,800,219
- Issue date Sep 21, 2010
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240404926
- Publication date Dec 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP
- Publication number 20240395662
- Publication date Nov 28, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ingoo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT C...
- Publication number 20240332117
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Changsun YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20240282663
- Publication date Aug 22, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES
- Publication number 20240274506
- Publication date Aug 15, 2024
- Semiconductor Components Industries, LLC
- Changsun YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
- Publication number 20240266252
- Publication date Aug 8, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...
- Publication number 20240250042
- Publication date Jul 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20240237216
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUIDIC-CHANNEL COOLED SUBSTRATES
- Publication number 20240194564
- Publication date Jun 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES
- Publication number 20240186218
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
- Publication number 20240170378
- Publication date May 23, 2024
- Semiconductor Components Industries, LLC
- Heejo CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE
- Publication number 20240162110
- Publication date May 16, 2024
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET
- Publication number 20240162117
- Publication date May 16, 2024
- Semiconductor Components Industries, LLC
- Yoonsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MO...
- Publication number 20240136259
- Publication date Apr 25, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20240138069
- Publication date Apr 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED M...
- Publication number 20240128197
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Olaf ZSCHIESCHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATES AND RELATED METHODS
- Publication number 20240120253
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20240055334
- Publication date Feb 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20240030108
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES
- Publication number 20230361011
- Publication date Nov 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES
- Publication number 20230335459
- Publication date Oct 19, 2023
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20230327350
- Publication date Oct 12, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20230253362
- Publication date Aug 10, 2023
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
- Publication number 20230225044
- Publication date Jul 13, 2023
- Semiconductor Components Industries, LLC
- Oseob JEON
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE
- Publication number 20230019930
- Publication date Jan 19, 2023
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION DIRECT COOLING MODULES AND RELATED METHODS
- Publication number 20220406684
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING PACKAGE
- Publication number 20220406683
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20220093487
- Publication date Mar 24, 2022
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit direct cooling systems having substrates in cont...

Integration of semiconductor device assemblies with thermal dissipa...

Semiconductor device package assemblies with direct leadframe attac...

Power module package and method of manufacturing the same

Semiconductor device package assemblies and methods of manufacture

Semiconductor package having a spacer with a junction cooling pipe

Semiconductor die package including a one-body clip

Semiconductor package and related methods

Stray inductance reduction in packaged semiconductor devices

Power module package

Semiconductor package having junction cooling pipes embedded in sub...

Semiconductor package and related methods

Stray inductance reduction in packaged semiconductor devices and mo...

Package including a semiconductor die and a capacitive component

Apparatus related to an improved package including a semiconductor die

Semiconductor die package and method for making the same

Power module package having excellent heat sink emission capability...

Wafer level MOSFET metallization

Semiconductor die package and method for making the same

Vertical MOSFET transistor having source/drain contacts disposed on...

High-power semiconductor die packages with integrated heat-sink cap...

Semiconductor die package and method for making the same

High-power semiconductor die packages with integrated heat-sink cap...

Patents Applicationslast 30 patents

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT C...

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES

SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTAC...

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

FLUIDIC-CHANNEL COOLED SUBSTRATES

MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES

POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE

POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET

CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MO...

SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES

ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED M...

INTEGRATED SUBSTRATES AND RELATED METHODS

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

MOLDED POWER MODULES

THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

HIGH POWER MODULE PACKAGE STRUCTURES

STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES

DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE

IMMERSION DIRECT COOLING MODULES AND RELATED METHODS

IMMERSION COOLING PACKAGE

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS