TREA

Osher Avsian

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  • Kiryat Ono, IL
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer level chip packaging
    • Patent number 7,936,062
    • Issue date May 3, 2011
    • Tessera Technologies Ireland Limited
    • Giles Humpston
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    Wafer level chip packaging
    • Publication number 20070190691
    • Publication date Aug 16, 2007
    • Tessera Technologies Hungary Kft.
    • Giles Humpston
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Wafer level packaging to lidded chips
    • Publication number 20070190747
    • Publication date Aug 16, 2007
    • Tessera Technologies Hungary Kft.
    • Giles Humpston
    • B81 - MICRO-STRUCTURAL TECHNOLOGY