Osvaldo J. Lopez

Person

North Bergen, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief for flip-chip packaged devices
- Patent number 11,930,590
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High I/O density flip-chip QFN
- Patent number 11,817,375
- Issue date Nov 14, 2023
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metal layer in power packages
- Patent number 11,784,114
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive plate stress reduction feature
- Patent number 11,658,130
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,640,932
- Issue date May 2, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 11,177,246
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,177,197
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter monolithically integrating transistors, carrier, an...
- Patent number 11,043,477
- Issue date Jun 22, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,024,564
- Issue date Jun 1, 2021
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having terminals directly attachable to circui...
- Patent number 10,930,582
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 10,438,936
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package having electrical functionality by embedded passive...
- Patent number 10,153,220
- Issue date Dec 11, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 10,121,716
- Issue date Nov 6, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded electronic system having stacked semic...
- Patent number 10,109,614
- Issue date Oct 23, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 10,062,624
- Issue date Aug 28, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter monolithically integrating transistors, carrier, an...
- Patent number 10,050,025
- Issue date Aug 14, 2018
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multi-chip module clips with connector bar
- Patent number 9,935,041
- Issue date Apr 3, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 9,859,261
- Issue date Jan 2, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package having electrical functionality by embedded passive...
- Patent number 9,818,662
- Issue date Nov 14, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin power transistor and synchronous buck converter having c...
- Patent number 9,779,967
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Juan A Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 9,721,860
- Issue date Aug 1, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating multi-output power converters having vertically stacked...
- Patent number 9,653,388
- Issue date May 16, 2017
- Texas Instruments Incorporated
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 9,640,519
- Issue date May 2, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (“IC”) assembly includes an IC die with a top me...
- Patent number 9,553,068
- Issue date Jan 24, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC-DC converter having terminals of semiconductor chips directly at...
- Patent number 9,543,240
- Issue date Jan 10, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
High performance power transistor having ultra-thin package
- Patent number 9,508,633
- Issue date Nov 29, 2016
- Texas Instruments Incorporated
- Juan A Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20240224415
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20240047330
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS DEVICE PACKAGE AND METHODS
- Publication number 20230411262
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20230268253
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20220210911
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PLATE STRESS REDUCTION FEATURE
- Publication number 20220208692
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20220181241
- Publication date Jun 9, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20220115308
- Publication date Apr 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20210265246
- Publication date Aug 26, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20210090980
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE WITH FILM ISOLATED POWER STACK
- Publication number 20200402894
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH I/O DENSITY FLIP-CHIP QFN
- Publication number 20200258822
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE WITH MULTIPLE HEAT CHANNELS
- Publication number 20200168533
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...
- Publication number 20190385992
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter Monolithically Integrating Transistors, Carrier, an...
- Publication number 20180331083
- Publication date Nov 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...
- Publication number 20180096978
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...
- Publication number 20180040527
- Publication date Feb 8, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER
- Publication number 20170301595
- Publication date Oct 19, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER
- Publication number 20170301596
- Publication date Oct 19, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER MONOLITHICALLY INTEGRATING TRANSISTORS, CARRIER, AN...
- Publication number 20170229435
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...
- Publication number 20170194306
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TERMINALS DIRECTLY ATTACHABLE TO CIRCUI...
- Publication number 20170077017
- Publication date Mar 16, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC-DC CONVERTER HAVING TERMINALS OF SEMICONDUCTOR CHIPS DIRECTLY AT...
- Publication number 20160218054
- Publication date Jul 28, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SILICON PACKAGE FOR EMBEDDED ELECTRONIC SYSTEM HAVING STACKED SEMIC...
- Publication number 20160172338
- Publication date Jun 16, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER
- Publication number 20160133534
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...
- Publication number 20160133535
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...
- Publication number 20160133616
- Publication date May 12, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Multi-Output Power Converters Having Vertically Stacked...
- Publication number 20160064352
- Publication date Mar 3, 2016
- Texas Instruments Incorpoated
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Multi-Output Power Converters Having Vertically Stacked...
- Publication number 20160064313
- Publication date Mar 3, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Multi-Output Power Converters Having Vertically Stacked...
- Publication number 20160064361
- Publication date Mar 3, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS

Osvaldo J. Lopez

Person

Patents Grantslast 30 patents

Packaged electronic device with film isolated power stack

Multi-die package with multiple heat channels

Stress relief for flip-chip packaged devices

Semiconductor package with solder standoff

High I/O density flip-chip QFN

Plated metal layer in power packages

Conductive plate stress reduction feature

Packaged electronic device with film isolated power stack

Photo-sensitive silicon package embedding self-powered electronic s...

Semiconductor package with solder standoff

Power converter monolithically integrating transistors, carrier, an...

Packaged electronic device with film isolated power stack

Semiconductor device having terminals directly attachable to circui...

Photo-sensitive silicon package embedding self-powered electronic s...

Silicon package having electrical functionality by embedded passive...

Silicon package for embedded semiconductor chip and power converter

Silicon package for embedded electronic system having stacked semic...

Silicon package for embedded semiconductor chip and power converter

Power converter monolithically integrating transistors, carrier, an...

Multi-chip module clips with connector bar

Photo-sensitive silicon package embedding self-powered electronic s...

Silicon package having electrical functionality by embedded passive...

Ultra-thin power transistor and synchronous buck converter having c...

Silicon package for embedded semiconductor chip and power converter

Integrating multi-output power converters having vertically stacked...

Photo-sensitive silicon package embedding self-powered electronic s...

Integrated circuit (“IC”) assembly includes an IC die with a top me...

DC-DC converter having terminals of semiconductor chips directly at...

High performance power transistor having ultra-thin package

Stacked synchronous buck converter having chip embedded in outside...

Patents Applicationslast 30 patents

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

PLATED METAL LAYER IN POWER PACKAGES

MICROELECTRONICS DEVICE PACKAGE AND METHODS

Packaged Electronic Device With Film Isolated Power Stack

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

CONDUCTIVE PLATE STRESS REDUCTION FEATURE

PLATED METAL LAYER IN POWER PACKAGES

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

Packaged Electronic Device With Film Isolated Power Stack

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

PACKAGED ELECTRONIC DEVICE WITH FILM ISOLATED POWER STACK

HIGH I/O DENSITY FLIP-CHIP QFN

MULTI-DIE PACKAGE WITH MULTIPLE HEAT CHANNELS

PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...

Power Converter Monolithically Integrating Transistors, Carrier, an...

Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...

SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...

SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER

SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER

POWER CONVERTER MONOLITHICALLY INTEGRATING TRANSISTORS, CARRIER, AN...

Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...

SEMICONDUCTOR DEVICE HAVING TERMINALS DIRECTLY ATTACHABLE TO CIRCUI...

DC-DC CONVERTER HAVING TERMINALS OF SEMICONDUCTOR CHIPS DIRECTLY AT...

SILICON PACKAGE FOR EMBEDDED ELECTRONIC SYSTEM HAVING STACKED SEMIC...

SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER

SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...

PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...

Integrating Multi-Output Power Converters Having Vertically Stacked...

Integrating Multi-Output Power Converters Having Vertically Stacked...

Integrating Multi-Output Power Converters Having Vertically Stacked...