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Otto Berger

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  • Grafling, DE
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Patents Grantslast 30 patents

  • Information Patent Grant

    Sheet-molded chip-scale package
    • Patent number 8,487,435
    • Issue date Jul 16, 2013
    • TriQuint Semiconductor, Inc.
    • Frank J. Juskey
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SHEET-MOLDED CHIP-SCALE PACKAGE
    • Publication number 20120080768
    • Publication date Apr 5, 2012
    • TriQuint Semiconductor, Inc.
    • Frank J. Juskey
    • H01 - BASIC ELECTRIC ELEMENTS