Owai H. Low

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Insulated bonding wire tool for microelectronic packaging
- Patent number 6,991,147
- Issue date Jan 31, 2006
- LSI Logic Corporation
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated bonding wire for microelectronic packaging
- Patent number 6,670,214
- Issue date Dec 30, 2003
- LSI Logic Corporation
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced tape ball grid array package
- Patent number 6,002,169
- Issue date Dec 14, 1999
- LSI Logic Corporation
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Insulated bonding wire tool for microelectronic packaging
- Publication number 20040182911
- Publication date Sep 23, 2004
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS