Owen R. Fay

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of packaging an integrated circuit die
- Patent number 7,595,226
- Issue date Sep 29, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protected active die region and method...
- Patent number 7,579,219
- Issue date Aug 25, 2009
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging
- Patent number 7,425,464
- Issue date Sep 16, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-resistant copper bond pad and integrated device
- Patent number 7,078,796
- Issue date Jul 18, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Gregory J. Dunn
- G01 - MEASURING TESTING
Information Patent Grant
Die encapsulation using a porous carrier
- Patent number 7,015,075
- Issue date Mar 21, 2006
- Freescale Semiconuctor, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level MEMS packaging
- Patent number 6,953,985
- Issue date Oct 11, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low cost fabrication and assembly of lid for semiconductor devices
- Patent number 6,949,398
- Issue date Sep 27, 2005
- Freescale Semiconductor, Inc.
- William H. Lytle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Under bump metallurgy structural design for high reliability bumped...
- Patent number 6,930,032
- Issue date Aug 16, 2005
- Freescale Semiconductor, Inc.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for eliminating voiding in plated solder
- Patent number 6,780,751
- Issue date Aug 24, 2004
- Freescale Semiconductor, Inc.
- Owen Fay
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE
- Publication number 20090061564
- Publication date Mar 5, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...
- Publication number 20080182363
- Publication date Jul 31, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Craig S. Amrine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Perforated embedded plane package and method
- Publication number 20070212813
- Publication date Sep 13, 2007
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for planarizing vias formed in a substrate
- Publication number 20070212865
- Publication date Sep 13, 2007
- Craig Amrine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device packaging
- Publication number 20070210461
- Publication date Sep 13, 2007
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with a protected active die region and method...
- Publication number 20060192301
- Publication date Aug 31, 2006
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with a protected active die region and method...
- Publication number 20050242425
- Publication date Nov 3, 2005
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die encapsulation using a porous carrier
- Publication number 20050176180
- Publication date Aug 11, 2005
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrosion-resistant bond pad and integrated device
- Publication number 20050104207
- Publication date May 19, 2005
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrosion-resistant bond pad and integrated device
- Publication number 20050001316
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Timothy B. Dean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrosion-resistant copper bond pad and integrated device
- Publication number 20050001324
- Publication date Jan 6, 2005
- MOTOROLA, INC.
- Gregory J. Dunn
- G01 - MEASURING TESTING
Information Patent Application
Low cost fabrication and assembly of lid for semiconductor devices
- Publication number 20040087053
- Publication date May 6, 2004
- MOTOROLA INC.
- William H. Lytle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for eliminating voiding in plated solder
- Publication number 20040072416
- Publication date Apr 15, 2004
- MOTOROLA INC.
- Owen Fay
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer level MEMS packaging
- Publication number 20030230798
- Publication date Dec 18, 2003
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Under bump metallurgy structural design for high reliability bumped...
- Publication number 20030214036
- Publication date Nov 20, 2003
- MOTOROLA INC.
- Vijay Sarihan
- H01 - BASIC ELECTRIC ELEMENTS

Owen R. Fay

Person

Patents Grantslast 30 patents

Method of packaging an integrated circuit die

Semiconductor device with a protected active die region and method...

Semiconductor device packaging

Corrosion-resistant copper bond pad and integrated device

Die encapsulation using a porous carrier

Wafer level MEMS packaging

Low cost fabrication and assembly of lid for semiconductor devices

Under bump metallurgy structural design for high reliability bumped...

Method for eliminating voiding in plated solder

Patents Applicationslast 30 patents

METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE

METHOD FOR FORMING A MICROELECTRONIC ASSEMBLY INCLUDING ENCAPSULATI...

Perforated embedded plane package and method

Method for planarizing vias formed in a substrate

Semiconductor device packaging

Semiconductor device with a protected active die region and method...

Semiconductor device with a protected active die region and method...

Die encapsulation using a porous carrier

Corrosion-resistant bond pad and integrated device

Corrosion-resistant bond pad and integrated device

Corrosion-resistant copper bond pad and integrated device

Low cost fabrication and assembly of lid for semiconductor devices

Method for eliminating voiding in plated solder

Wafer level MEMS packaging

Under bump metallurgy structural design for high reliability bumped...