Padam Jain

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control element utilized in device die packages
- Patent number 11,955,406
- Issue date Apr 9, 2024
- Google LLC
- Yingying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weight optimized stiffener and sealing structure for direct liquid...
- Patent number 11,721,641
- Issue date Aug 8, 2023
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weight optimized stiffener and sealing structure for direct liquid...
- Patent number 11,664,329
- Issue date May 30, 2023
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct liquid cooling with O-ring sealing
- Patent number 11,488,890
- Issue date Nov 1, 2022
- Google LLC
- Jorge Padilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for direct liquid cooling via metal channels
- Patent number 10,964,625
- Issue date Mar 30, 2021
- Google LLC
- Padam Jain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Structures for Coupling Thermal Dissipating Elements an...
- Publication number 20240121931
- Publication date Apr 11, 2024
- Google LLC
- Yingshi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package
- Publication number 20240055317
- Publication date Feb 15, 2024
- Google LLC
- Emad Samadiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pin Fin Placement Assembly for Forming Temperature Control Element...
- Publication number 20240038620
- Publication date Feb 1, 2024
- Google LLC
- Yingshi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Weight Optimized Stiffener and Sealing Structure for Direct Liquid...
- Publication number 20230260931
- Publication date Aug 17, 2023
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature Control Element Utilized in Device Die Packages
- Publication number 20230163048
- Publication date May 25, 2023
- Google LLC
- Yingying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Liquid Cooling With O-Ring Sealing
- Publication number 20230037380
- Publication date Feb 9, 2023
- Google LLC
- Jorge Padilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20210378106
- Publication date Dec 2, 2021
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Weight Optimized Stiffener and Sealing Structure for Direct Liquid...
- Publication number 20210366841
- Publication date Nov 25, 2021
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spring Loaded Compliant Coolant Distribution Manifold for Direct Li...
- Publication number 20210366806
- Publication date Nov 25, 2021
- Google LLC
- Madhusudan K. Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Direct Liquid Cooling With O-Ring Sealing
- Publication number 20210366807
- Publication date Nov 25, 2021
- Google LLC
- Jorge Padilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR DIRECT LIQUID COOLING VIA METAL CHANNELS
- Publication number 20200273777
- Publication date Aug 27, 2020
- Google LLC
- Padam Jain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Methods and heat distribution devices for thermal management of chi...

Temperature control element utilized in device die packages

Weight optimized stiffener and sealing structure for direct liquid...

Weight optimized stiffener and sealing structure for direct liquid...

Direct liquid cooling with O-ring sealing

Device and method for direct liquid cooling via metal channels

Patents Applicationslast 30 patents

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Methods and Structures for Coupling Thermal Dissipating Elements an...

Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package

Pin Fin Placement Assembly for Forming Temperature Control Element...

Weight Optimized Stiffener and Sealing Structure for Direct Liquid...

Temperature Control Element Utilized in Device Die Packages

Direct Liquid Cooling With O-Ring Sealing

Methods And Heat Distribution Devices For Thermal Management Of Chi...

Weight Optimized Stiffener and Sealing Structure for Direct Liquid...

Spring Loaded Compliant Coolant Distribution Manifold for Direct Li...

Direct Liquid Cooling With O-Ring Sealing

DEVICE AND METHOD FOR DIRECT LIQUID COOLING VIA METAL CHANNELS