Padraic Shafer

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low Cu percentages for reducing shorts in AlCu lines
- Patent number 6,960,306
- Issue date Nov 1, 2005
- Infineon Technologies AG
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method and structure for simultaneously forming a tre...
- Patent number 6,936,512
- Issue date Aug 30, 2005
- International Business Machines Corporation
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling high aspect ratio isolation structures with polysilazane ba...
- Patent number 6,869,860
- Issue date Mar 22, 2005
- International Business Machines Corporation
- Michael P. Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,740,539
- Issue date May 25, 2004
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner with poor step coverage to improve contact resistance in W co...
- Patent number 6,734,097
- Issue date May 11, 2004
- Infineon Technologies AG
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for salicide trench capacitor plate electrode
- Patent number 6,664,161
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Michael Patrick Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,570,256
- Issue date May 27, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FET STRUCTURE USING DISPOSABLE SPACER AND STRESS INDUCING LAYER
- Publication number 20080124880
- Publication date May 29, 2008
- Chartered Semiconductor Manufacturing LTD.
- Wenhe Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filling high aspect ratio isolation structures with polysilazane ba...
- Publication number 20050179112
- Publication date Aug 18, 2005
- International Business Machines Corporation
- Michael P. Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING HIGH ASPECT RATIO ISOLATION STRUCTURES WITH POLYSILAZANE BA...
- Publication number 20040248374
- Publication date Dec 9, 2004
- International Business Machines Corporation
- Michael P. Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving the electrical resistance of con...
- Publication number 20040155268
- Publication date Aug 12, 2004
- Infineon Technologies North America Corp.
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor method and structure for simultaneously forming a tre...
- Publication number 20040063277
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Michael P. Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cu percentages for reducing shorts in AlCu lines
- Publication number 20040020891
- Publication date Feb 5, 2004
- Infineon Technologies North America Corp.
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SALICIDE TRENCH CAPACITOR PLATE ELECTRODE
- Publication number 20030207532
- Publication date Nov 6, 2003
- International Business Machines Corporation
- Michael Patrick Chudzik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030153198
- Publication date Aug 14, 2003
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner with poor step coverage to improve contact resistance in W co...
- Publication number 20030068894
- Publication date Apr 10, 2003
- Infineon Technologies North America Corp.
- Roy C. Iggulden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030017642
- Publication date Jan 23, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Padraic Shafer

Person

Patents Grantslast 30 patents

Low Cu percentages for reducing shorts in AlCu lines

Semiconductor method and structure for simultaneously forming a tre...

Filling high aspect ratio isolation structures with polysilazane ba...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Liner with poor step coverage to improve contact resistance in W co...

Method and structure for salicide trench capacitor plate electrode

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Patents Applicationslast 30 patents

FET STRUCTURE USING DISPOSABLE SPACER AND STRESS INDUCING LAYER

Filling high aspect ratio isolation structures with polysilazane ba...

FILLING HIGH ASPECT RATIO ISOLATION STRUCTURES WITH POLYSILAZANE BA...

Method and apparatus for improving the electrical resistance of con...

Semiconductor method and structure for simultaneously forming a tre...

Low Cu percentages for reducing shorts in AlCu lines

METHOD AND STRUCTURE FOR SALICIDE TRENCH CAPACITOR PLATE ELECTRODE

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Liner with poor step coverage to improve contact resistance in W co...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...