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Pai-Chou Liu

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  • Kaoshiung, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20210391278
    • Publication date Dec 16, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Li-Hua TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20200335452
    • Publication date Oct 22, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Li-Hua TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for mounting a semiconductor package onto PCB
    • Publication number 20080226877
    • Publication date Sep 18, 2008
    • Advanced Semiconductor Engineering, Inc.
    • Pai-Chou Liu
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Substrate structure having N-SMD ball pads
    • Publication number 20080042278
    • Publication date Feb 21, 2008
    • Pai-Chou Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Surface Mounting Method
    • Publication number 20070254469
    • Publication date Nov 1, 2007
    • ADVANCED SEMICONDUCTOR ENGINEERING INC.
    • Pai-Chou Liu
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Package of leadframe with heatsinks
    • Publication number 20070069345
    • Publication date Mar 29, 2007
    • Pai-Chou Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Substrate with mesh
    • Publication number 20050082680
    • Publication date Apr 21, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Pai-Chou Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for mounting a semiconductor package onto PCB
    • Publication number 20050061854
    • Publication date Mar 24, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Pai-Chou Liu
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...