Pai-Chun Peter Zung

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an image sensor package
- Patent number 9,484,385
- Issue date Nov 1, 2016
- Visera Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 9,231,012
- Issue date Jan 5, 2016
- Visera Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making wafer level image module
- Patent number 8,524,521
- Issue date Sep 3, 2013
- Visera Technologies Company Limited
- Hsiao-Wen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Compact camera module and method for fabricating the same
- Patent number 8,500,344
- Issue date Aug 6, 2013
- VisEra Technologies Co., Ltd.
- Pai-Chun Peter Zung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensing devices and methods for fabricating the same
- Patent number 8,153,458
- Issue date Apr 10, 2012
- Visera Technologies Company Limited
- Jui-Ping Weng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Image sensor package and fabrication method thereof
- Patent number 7,898,070
- Issue date Mar 1, 2011
- Visera Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aspheric lens structures and fabrication methods thereof
- Patent number 7,826,148
- Issue date Nov 2, 2010
- Visera Technologies Company Limited
- Pai-Chun Peter Zung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for forming light-transmitting regions
- Patent number 7,732,244
- Issue date Jun 8, 2010
- Visera Technologies Company Limited
- Chieh-Yuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module having precise image-projection control
- Patent number 7,703,997
- Issue date Apr 27, 2010
- Visera Technologies, Co., Ltd.
- Hsiao-Wen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic assembly for image sensor device and fabrication method...
- Patent number 7,679,167
- Issue date Mar 16, 2010
- Visera Technologies Company, Limited
- Teng-Sheng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor package and fabrication method thereof
- Patent number 7,595,220
- Issue date Sep 29, 2009
- Visera Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level image module
- Patent number 7,592,680
- Issue date Sep 22, 2009
- Visera Technologies Company Ltd.
- Hsiao-Wen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensing devices and methods for fabricating the same
- Patent number 7,528,420
- Issue date May 5, 2009
- Visera Technologies Company Limited
- Jui-Peng Weng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR DEVICES
- Publication number 20160351612
- Publication date Dec 1, 2016
- SILICON OPTRONICS, INC.
- Pai-Chun ZUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN IMAGE SENSOR PACKAGE
- Publication number 20160079304
- Publication date Mar 17, 2016
- VISERA TECHNOLOGIES COMPANY LIMITED
- Jui-Ping WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT CAMERA MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130028589
- Publication date Jan 31, 2013
- Pai-Chun Peter ZUNG
- G02 - OPTICS
Information Patent Application
IMAGE SENSOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20090309178
- Publication date Dec 17, 2009
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE MODULE
- Publication number 20090294639
- Publication date Dec 3, 2009
- Hsiao-Wen LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20090181490
- Publication date Jul 16, 2009
- VISERA TECHNOLOGIES COMPANY LIMITED
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming light-transmitting regions
- Publication number 20090162967
- Publication date Jun 25, 2009
- VisEra Technologies Company Limited
- Chieh-Yuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package and fabrication method thereof
- Publication number 20090001495
- Publication date Jan 1, 2009
- VisEra Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20080290438
- Publication date Nov 27, 2008
- VISERA TECHNOLOGIES COMPANY LIMITED
- Jui-Peng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aspheric lens structures and fabrication methods thereof
- Publication number 20080198481
- Publication date Aug 21, 2008
- VisEra Technologies Company Limited
- Pai-Chun Peter Zung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Electronic assembly for image sensor device and fabrication method...
- Publication number 20080164550
- Publication date Jul 10, 2008
- VisEra Technologies Company Limited
- Teng-Sheng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSING DEVICE AND PACKAGE METHOD THEREFOR
- Publication number 20070279520
- Publication date Dec 6, 2007
- VISERA TECHNOLOGIES COMPANY, LTD.
- Hsiao-Wen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor module having precise image-projection control
- Publication number 20070166029
- Publication date Jul 19, 2007
- Visera Technologies, Co. Ltd.
- Hsiao-Wen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer level image module
- Publication number 20070070511
- Publication date Mar 29, 2007
- VISERA TECHNOLOGIES, COMPANY LTD.
- Hsiao-Wen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Pai-Chun Peter Zung

Person

Patents Grantslast 30 patents

Method for fabricating an image sensor package

Image sensor package

Method for making wafer level image module

Compact camera module and method for fabricating the same

Image sensing devices and methods for fabricating the same

Image sensor package and fabrication method thereof

Aspheric lens structures and fabrication methods thereof

Method for forming light-transmitting regions

Image sensor module having precise image-projection control

Electronic assembly for image sensor device and fabrication method...

Image sensor package and fabrication method thereof

Wafer level image module

Image sensing devices and methods for fabricating the same

Patents Applicationslast 30 patents

IMAGE SENSOR DEVICES

METHOD FOR FABRICATING AN IMAGE SENSOR PACKAGE

COMPACT CAMERA MODULE AND METHOD FOR FABRICATING THE SAME

IMAGE SENSOR PACKAGE AND FABRICATION METHOD THEREOF

WAFER LEVEL IMAGE MODULE

IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME

Method for forming light-transmitting regions

Image sensor package and fabrication method thereof

IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME

Aspheric lens structures and fabrication methods thereof

Electronic assembly for image sensor device and fabrication method...

IMAGE SENSING DEVICE AND PACKAGE METHOD THEREFOR

Image sensor module having precise image-projection control

Wafer level image module