Pai-Sheng Cheng

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Filp chip package
- Patent number 10,777,525
- Issue date Sep 15, 2020
- Himax Technologies Limited
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, fabricating method thereof and package structure
- Patent number 8,674,503
- Issue date Mar 18, 2014
- Himax Technologies Limited
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
COF packaging structure, method of manufacturing the COF packaging...
- Patent number 7,906,374
- Issue date Mar 15, 2011
- Himax Technologies Limited
- Chiu-Shun Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a film printed circuit board
- Patent number 7,473,459
- Issue date Jan 6, 2009
- Himax Technologies Limited
- Chia-Hui Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pad and chip structure
- Patent number 7,064,449
- Issue date Jun 20, 2006
- Himax Technologies, Inc.
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,061,078
- Issue date Jun 13, 2006
- Himax Technologies Inc.
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILP CHIP PACKAGE
- Publication number 20200312804
- Publication date Oct 1, 2020
- HIMAX TECHNOLOGIES LIMITED
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20130087906
- Publication date Apr 11, 2013
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COF PACKAGING STRUCTURE, METHOD OF MANUFACTURING THE COF PACKAGING...
- Publication number 20090206472
- Publication date Aug 20, 2009
- Chiu-Shun Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD
- Publication number 20090101513
- Publication date Apr 23, 2009
- Chia-Hui WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CHIP ON FILM AND STRUCTURE THEREOF
- Publication number 20090020316
- Publication date Jan 22, 2009
- Chia-Hui Wu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
A METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD
- Publication number 20060251873
- Publication date Nov 9, 2006
- Chia-Hui WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package
- Publication number 20060081968
- Publication date Apr 20, 2006
- Shwang Shi Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD AND CHIP STRUCTURE
- Publication number 20060006531
- Publication date Jan 12, 2006
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connection structure
- Publication number 20050133912
- Publication date Jun 23, 2005
- Chia-Hui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20050098884
- Publication date May 12, 2005
- Himax Technologies, Inc.
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Pai-Sheng Cheng

Person

Patents Grantslast 30 patents

Filp chip package

Circuit board, fabricating method thereof and package structure

COF packaging structure, method of manufacturing the COF packaging...

Method of manufacturing a film printed circuit board

Bonding pad and chip structure

Semiconductor package

Patents Applicationslast 30 patents

FILP CHIP PACKAGE

CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE

COF PACKAGING STRUCTURE, METHOD OF MANUFACTURING THE COF PACKAGING...

METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING CHIP ON FILM AND STRUCTURE THEREOF

A METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD

Semiconductor package

BONDING PAD AND CHIP STRUCTURE

Electrical connection structure

Semiconductor package