Pai Y. Cheng

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Hsin Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit wafer container
- Patent number 4,787,508
- Issue date Nov 29, 1988
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin J. Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194646
- Publication date Jun 13, 2024
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240074127
- Publication date Feb 29, 2024
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF
- Publication number 20230378044
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS