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Pai-Yuan Li

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  • Taichung, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250062250
    • Publication date Feb 20, 2025
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUAN-YU HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230178498
    • Publication date Jun 8, 2023
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUAN-YU HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20200251427
    • Publication date Aug 6, 2020
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUAN-YU HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME
    • Publication number 20200203299
    • Publication date Jun 25, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Sung-Hui HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of Manufacture of a Semiconductor Device
    • Publication number 20200006178
    • Publication date Jan 2, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuan-Yu Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20190244925
    • Publication date Aug 8, 2019
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUAN-YU HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20190067231
    • Publication date Feb 28, 2019
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUAN-YU HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Method of Manufacture
    • Publication number 20190006256
    • Publication date Jan 3, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuan-Yu Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Thermal Interface Material Having Different Thicknesses In Packages
    • Publication number 20180350754
    • Publication date Dec 6, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sung-Hui Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Thermal Interface Material Having Different Thicknesses in Packages
    • Publication number 20180350755
    • Publication date Dec 6, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Sung-Hui Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180261554
    • Publication date Sep 13, 2018
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUAN-YU HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
    • Publication number 20150179597
    • Publication date Jun 25, 2015
    • Siliconware Precision Industries Co., Ltd.
    • Pai-Yuan Li
    • H01 - BASIC ELECTRIC ELEMENTS