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Pak C. Wong
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Milpitas, CA, US
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last 30 patents
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Patent Grant
Top infrared heating for bonding operations
Patent number
6,384,366
Issue date
May 7, 2002
Advanced Micro Devices, Inc.
Pak C. Wong
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Non-contact automatic height sensing using air pressure for die bon...
Patent number
6,376,265
Issue date
Apr 23, 2002
Advanced Micro Devices, Inc.
Pak C. Wong
H01 - BASIC ELECTRIC ELEMENTS