PaLan LEE

Person

Daegu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip on film package including distributed via plugs
- Patent number 9,437,526
- Issue date Sep 6, 2016
- Samsung Electronics Co., Ltd.
- So-Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus
- Patent number 9,313,889
- Issue date Apr 12, 2016
- Samsung Electronics Co., Ltd.
- Kyoungsuk Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip on film package and display device including the same
- Patent number 9,280,182
- Issue date Mar 8, 2016
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip on film (COF) substrate, COF package and display device includ...
- Patent number 9,059,162
- Issue date Jun 16, 2015
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device package
- Patent number 8,569,114
- Issue date Oct 29, 2013
- Samsung Electronics Co. Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor housing package, semiconductor package structure incl...
- Patent number 8,436,462
- Issue date May 7, 2013
- Samsung Electronics Co., Ltd.
- Dong-Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including heat slugs
- Patent number 8,269,342
- Issue date Sep 18, 2012
- Samsung Electronics Co., Ltd.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20160162091
- Publication date Jun 9, 2016
- Samsung Electronics Co., Ltd.
- JEONG-KYU HA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY APPARATUS
- Publication number 20140328031
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- KYOUNGSUK YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ON FILM PACKAGE INCLUDING DISTRIBUTED VIA PLUGS
- Publication number 20140327148
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- So-Young LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20140246687
- Publication date Sep 4, 2014
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip on Film (COF) Substrate, COF Package and Display Device Includ...
- Publication number 20140054793
- Publication date Feb 27, 2014
- Jeong-Kyu Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Housing Package, Semiconductor Package Structure Incl...
- Publication number 20110233755
- Publication date Sep 29, 2011
- Samsung Electronics Co., Ltd.
- Dong-Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages including heat slugs
- Publication number 20110018119
- Publication date Jan 27, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20100304530
- Publication date Dec 2, 2010
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Chip on film package including distributed via plugs

Display apparatus

Chip on film package and display device including the same

Chip on film (COF) substrate, COF package and display device includ...

Method of forming a semiconductor device package

Semiconductor housing package, semiconductor package structure incl...

Semiconductor packages including heat slugs

Patents Applicationslast 30 patents

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

DISPLAY APPARATUS

CHIP ON FILM PACKAGE INCLUDING DISTRIBUTED VIA PLUGS

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

Chip on Film (COF) Substrate, COF Package and Display Device Includ...

Semiconductor Housing Package, Semiconductor Package Structure Incl...

Semiconductor packages including heat slugs

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE