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Keelung, TW
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last 30 patents
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Patent Grant
Discrete circuit component having an up-right circuit die with late...
Patent number
6,870,261
Issue date
Mar 22, 2005
Comchip Technology Co., Ltd.
Chih-Liang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bonding method for semiconductor circuit components employing...
Patent number
6,818,541
Issue date
Nov 16, 2004
Comchip Technology Co., Ltd.
Cheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
[METAL BONDING METHOD FOR SEMICONDUCTOR CIRCUIT COMPONENTS EMPLOYIN...
Publication number
20040183196
Publication date
Sep 23, 2004
Cheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL BONDING METHOD FOR SEMICONDUCTOR CIRCUIT COMPONENTS EMPLOYING...
Publication number
20040185650
Publication date
Sep 23, 2004
Cheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISCRETE CIRCUIT COMPONENT HAVING AN UP-RIGHT CIRCUIT DIE WITH LATE...
Publication number
20040164406
Publication date
Aug 26, 2004
Chih-Liang Hu
H01 - BASIC ELECTRIC ELEMENTS