Pang Hup ONG

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of attaching semiconductor dies to...
- Patent number 8,592,258
- Issue date Nov 26, 2013
- United Test and Assembly Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper on organic solderability preservative (OSP) interconnect and...
- Patent number 8,247,272
- Issue date Aug 21, 2012
- United Test & Assembly Center Ltd.
- Yong Chuan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density internal ball grid array integrated circuit package
- Patent number 6,768,646
- Issue date Jul 27, 2004
- Texas Instruments Incorporated
- Fung Leng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating thin integrated circuit units
- Patent number 6,468,831
- Issue date Oct 22, 2002
- Texas Instruments Incorporated
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked double sided integrated circuit package
- Patent number 6,274,929
- Issue date Aug 14, 2001
- Texas Instruments Incorporated
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin chip-size integrated circuit package
- Patent number 6,091,140
- Issue date Jul 18, 2000
- Texas Instruments Incorporated
- Tuck Fook Toh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip size integrated circuit package
- Patent number 6,049,129
- Issue date Apr 11, 2000
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20120034738
- Publication date Feb 9, 2012
- QIMONDA AG
- Denver Paul C. CASTILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...
- Publication number 20100025849
- Publication date Feb 4, 2010
- United Test & Assembly Center Ltd.
- Yong Chuan KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20090194871
- Publication date Aug 6, 2009
- UTAC - United Test and Assembly Test Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin integrated circuit unit
- Publication number 20020000648
- Publication date Jan 3, 2002
- Chew Weng Leong
- H01 - BASIC ELECTRIC ELEMENTS

Pang Hup ONG

Person

Patents Grantslast 30 patents

Semiconductor package and method of attaching semiconductor dies to...

Copper on organic solderability preservative (OSP) interconnect and...

High density internal ball grid array integrated circuit package

Method of fabricating thin integrated circuit units

Stacked double sided integrated circuit package

Thin chip-size integrated circuit package

Chip size integrated circuit package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...

Thin integrated circuit unit