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Patents Grants
last 30 patents
Information
Patent Grant
Wafer electroplating apparatus
Patent number
7,449,091
Issue date
Nov 11, 2008
Industrial Technology Research Institute
Chen-Chung Du
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electroplating apparatus with functions of voltage detection and fl...
Patent number
7,238,265
Issue date
Jul 3, 2007
Industrial Technology Research Institute
Chih-Cheng Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Compress and position apparatus
Patent number
7,021,208
Issue date
Apr 4, 2006
Industrial Technology Research Institute
Chen-Chung Du
B30 - PRESSES
Information
Patent Grant
Method for low temperature liquid-phase deposition and method for c...
Patent number
6,803,329
Issue date
Oct 12, 2004
Industrial Technology Research Institute
Edward Y. Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabricating process for forming multi-layered metal bumps by electr...
Patent number
6,653,235
Issue date
Nov 25, 2003
Industrial Technology Research Institute
Muh-Wang Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for liquid phase deposition
Patent number
6,653,245
Issue date
Nov 25, 2003
Industrial Technology Research Institute
Muh-Wang Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tray input-output module
Patent number
6,558,110
Issue date
May 6, 2003
Industrial Technology Research Institute
Weng-Jung Lu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Wafer electroplating apparatus
Publication number
20060137974
Publication date
Jun 29, 2006
Chen-Chung Du
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Compress and position apparatus
Publication number
20050051023
Publication date
Mar 10, 2005
Chen-Chung Du
B30 - PRESSES
Information
Patent Application
Electroplating apparatus with functions of voltage detection and fl...
Publication number
20050051425
Publication date
Mar 10, 2005
Chih-Cheng Wang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
METHOD FOR LOW TEMPERATURE LIQUID-PHASE DEPOSITION AND METHOD FOR C...
Publication number
20040137753
Publication date
Jul 15, 2004
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Edward Y. Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer electroplating apparatus and method
Publication number
20040124090
Publication date
Jul 1, 2004
Chen-Chung Du
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method and apparatus for liquid phase deposition
Publication number
20030219978
Publication date
Nov 27, 2003
Industrial Technology Research Institute
Muh-Wang Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure of the metal bumping on the input/output connector of a s...
Publication number
20030107132
Publication date
Jun 12, 2003
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Pang-Ming Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Tray input-output module
Publication number
20020182051
Publication date
Dec 5, 2002
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Weng-Jung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabricating process for forming multi-layered metal bumps by electr...
Publication number
20020173073
Publication date
Nov 21, 2002
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Muh-Wang Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for liquid phase deposition
Publication number
20020173170
Publication date
Nov 21, 2002
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Muh-Wang Liang
H01 - BASIC ELECTRIC ELEMENTS