Pang-Yien Lin

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,455,159
- Issue date Sep 27, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and fabrication method thereof
- Patent number 9,362,217
- Issue date Jun 7, 2016
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,318,354
- Issue date Apr 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package having electrical conne...
- Patent number 9,177,837
- Issue date Nov 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and fabrication method thereof
- Patent number 9,171,741
- Issue date Oct 27, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 9,029,203
- Issue date May 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,981,575
- Issue date Mar 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,873,244
- Issue date Oct 28, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having electrical connecting structures and f...
- Patent number 8,716,861
- Issue date May 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 8,525,336
- Issue date Sep 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,421,199
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package having electrical connecting structures and f...
- Patent number 8,390,118
- Issue date Mar 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package structure
- Patent number 8,304,268
- Issue date Nov 6, 2012
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package structure fabrication method
- Patent number 7,934,313
- Issue date May 3, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Arrangement for increasing heat transfer coefficient between a heat...
- Patent number 4,794,984
- Issue date Jan 3, 1989
- Pang-Yien Lin
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20160013074
- Publication date Jan 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150091150
- Publication date Apr 2, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140284803
- Publication date Sep 25, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...
- Publication number 20140239475
- Publication date Aug 28, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNE...
- Publication number 20140206146
- Publication date Jul 24, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20130344661
- Publication date Dec 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20130200508
- Publication date Aug 8, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20130161802
- Publication date Jun 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130115738
- Publication date May 9, 2013
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130093086
- Publication date Apr 18, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CARRIER, PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130009311
- Publication date Jan 10, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20110156252
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20110159643
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20110156227
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20110157851
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Pang-Yien Lin

Person

Patents Grantslast 30 patents

Fabrication method of packaging substrate

Package on package structure and fabrication method thereof

Semiconductor package and fabrication method thereof

Fabrication method of semiconductor package having electrical conne...

Packaging substrate and fabrication method thereof

Method of fabricating semiconductor package

Semiconductor package structure

Package structure

Semiconductor package having electrical connecting structures and f...

Semiconductor package and method of fabricating the same

Semiconductor package structure

Semiconductor package having electrical connecting structures and f...

Fabrication method of semiconductor package structure

Package structure fabrication method

Arrangement for increasing heat transfer coefficient between a heat...

Patents Applicationslast 30 patents

FABRICATION METHOD OF PACKAGING SUBSTRATE

PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNE...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CARRIER, PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE