Pao-Hei Chang Chin

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Kaohsiung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a stacked chip package
- Patent number 6,387,728
- Issue date May 14, 2002
- Advanced Semiconductor Engineering, Inc.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for fabricating a stacked chip package
- Publication number 20020094605
- Publication date Jul 18, 2002
- Advanced Semiconductor Engineering, Inc.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS