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Hsinchu County, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Package substrate and method for manufacturing the same
Patent number
11,791,281
Issue date
Oct 17, 2023
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate and method for manufacturing the same
Patent number
11,749,619
Issue date
Sep 5, 2023
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Intermediate substrate and fabrication method thereof
Patent number
11,658,104
Issue date
May 23, 2023
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Shih-Ping Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging substrate, fabrication method and packaging...
Patent number
11,508,673
Issue date
Nov 22, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip packaging substrate and method for fabricating the same
Patent number
11,476,204
Issue date
Oct 18, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package substrate having heat dissipating metal sheet...
Patent number
11,450,597
Issue date
Sep 20, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package carrier board, method for fabricating the sam...
Patent number
11,404,348
Issue date
Aug 2, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package substrate, electronic package and methods for...
Patent number
11,335,630
Issue date
May 17, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip package substrate and method for fabricating the same
Patent number
11,183,447
Issue date
Nov 23, 2021
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip package substrate and method for preparing the same
Patent number
11,139,230
Issue date
Oct 5, 2021
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package and a method of fabricating the same
Patent number
11,069,540
Issue date
Jul 20, 2021
Phoenix Pioneer Technology Co., Ltd.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating package substrates
Patent number
10,745,818
Issue date
Aug 18, 2020
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Chun-Hsien Yu
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Interposer substrate and method of fabricating the same
Patent number
10,483,194
Issue date
Nov 19, 2019
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate and its fabrication method
Patent number
10,347,575
Issue date
Jul 9, 2019
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Chun-Hsien Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package substrate with metal on conductive...
Patent number
10,117,340
Issue date
Oct 30, 2018
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interposer substrate and method of fabricating the same
Patent number
10,014,242
Issue date
Jul 3, 2018
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate with metal on conductive portions and manufacturi...
Patent number
9,992,879
Issue date
Jun 5, 2018
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer substrate and method for fabricating the same
Patent number
9,911,626
Issue date
Mar 6, 2018
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate
Patent number
9,852,977
Issue date
Dec 26, 2017
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Chun-Hsien Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating package structure
Patent number
9,806,050
Issue date
Oct 31, 2017
Unimicron Technology Corp.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate structure
Patent number
9,780,022
Issue date
Oct 3, 2017
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer substrate and method of fabricating the same
Patent number
9,338,900
Issue date
May 10, 2016
Phoenix Pioneer Technology Co., Ltd.
Pao-Hung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package substrate and fabrication method thereof
Patent number
9,230,895
Issue date
Jan 5, 2016
Unimicron Technology Corporation
Pao-Hung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure having a semiconductor component embedded therein...
Patent number
9,093,459
Issue date
Jul 28, 2015
Unimicron Technology Corporation
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure for electrical testing and fabrication meth...
Patent number
8,222,528
Issue date
Jul 17, 2012
Unimicron Technology Corp.
Pao-Hung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat-conductive package structure
Patent number
7,786,571
Issue date
Aug 31, 2010
Unimicron Technology Corporation
Pao-Hung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating a metal protection layer on electrically con...
Patent number
7,627,946
Issue date
Dec 8, 2009
Phoenix Precision Technology Corporation
Pao Hung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal electroplating process of an electrically connecting pad stru...
Patent number
7,378,345
Issue date
May 27, 2008
Phoenix Precision Technology Corporation
Pao Hung Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
INDUCTOR STRUCTURE, MAGNETICALLY PERMEABLE BODY AND MANUFACTURING M...
Publication number
20240194386
Publication date
Jun 13, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Shih-Ping Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240161957
Publication date
May 16, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORE STRUCTURE OF INDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE...
Publication number
20240145155
Publication date
May 2, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA MODULE, ANTENNA SUPPORTING SUBSTRATE AND MANUFACTURING METH...
Publication number
20240136728
Publication date
Apr 25, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE CARRIER BOARD STRUCTURE AND MANUFACTURING MET...
Publication number
20240055274
Publication date
Feb 15, 2024
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME
Publication number
20220406734
Publication date
Dec 22, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTANCE STRUCTURE
Publication number
20220328613
Publication date
Oct 13, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERMEDIATE SUBSTRATE AND FABRICATION METHOD THEREOF
Publication number
20220285257
Publication date
Sep 8, 2022
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Shih-Ping Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20210296259
Publication date
Sep 23, 2021
Advanced Semiconductor Engineering, Inc.
You-Lung YEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING SUBSTRATE, FABRICATION METHOD AND PACKAGING...
Publication number
20210296260
Publication date
Sep 23, 2021
PHOENIX PIONEER TECHNOLOGY CO., LTD.
PAO-HUNG CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
Publication number
20210098351
Publication date
Apr 1, 2021
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, A...
Publication number
20200388564
Publication date
Dec 10, 2020
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE CARRIER BOARD, METHOD FOR FABRICATING THE SAM...
Publication number
20200388552
Publication date
Dec 10, 2020
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING PACKAGE SUBSTRATES
Publication number
20200332429
Publication date
Oct 22, 2020
PHOENIX PIONEER TECHNOLOGY CO., LTD.
CHUN-HSIEN YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, ELECTRONIC PACKAGE AND METHODS FOR...
Publication number
20200312756
Publication date
Oct 1, 2020
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGE SUBSTRATE AND METHOD FOR PREPARING THE SAME
Publication number
20200066624
Publication date
Feb 27, 2020
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME
Publication number
20190348375
Publication date
Nov 14, 2019
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME
Publication number
20180286794
Publication date
Oct 4, 2018
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF PACKAGE SUBSTRATE WITH METAL ON CONDUCTIVE...
Publication number
20180255651
Publication date
Sep 6, 2018
Phoenix Pioneer technology Co.,Ltd.
Che-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING PACKAGE SUBSTRATES
Publication number
20170198406
Publication date
Jul 13, 2017
PHOENIX PIONEER TECHNOLOGY CO., LTD.
CHUN-HSIEN YU
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Package Substrate
Publication number
20170148724
Publication date
May 25, 2017
PHOENIX PIONEER TECHNOLOGY CO., LTD.
CHUN-HSIEN YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE AND ITS FABRICATION METHOD
Publication number
20170047278
Publication date
Feb 16, 2017
PHOENIX PIONEER TECHNOLOGY CO., LTD.
CHUN-HSIEN YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
Publication number
20170034908
Publication date
Feb 2, 2017
Phoenix Pioneer technology Co.,Ltd.
Che-Wei Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Substrate Structure and Manufacturing Method Thereof
Publication number
20170018491
Publication date
Jan 19, 2017
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME
Publication number
20160163626
Publication date
Jun 9, 2016
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME
Publication number
20160073516
Publication date
Mar 10, 2016
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER SUBSTRATE AND METHOD FOR FABRICATING THE SAME
Publication number
20160037634
Publication date
Feb 4, 2016
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER SUBSTRATE AND A METHOD OF FABRICATING THE SAME
Publication number
20160037635
Publication date
Feb 4, 2016
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Pao-Hung CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
Publication number
20150287691
Publication date
Oct 8, 2015
Unimicron Technology Corp.
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE HAVING A SEMICONDUCTOR COMPONENT EMBEDDED THEREIN...
Publication number
20120120609
Publication date
May 17, 2012
Unimicron Technology Corporation
Pao-Hung Chou
H01 - BASIC ELECTRIC ELEMENTS