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Hsinchu, TW
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Patents Grants
last 30 patents
Information
Patent Grant
System-in-package packaging for minimizing bond wire contamination...
Patent number
8,217,520
Issue date
Jul 10, 2012
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip packages with spacers separating heat sinks and substrates
Patent number
7,843,058
Issue date
Nov 30, 2010
Taiwan Semiconductor Manufacturing Company, Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package packaging for minimizing bond wire contamination...
Patent number
7,719,122
Issue date
May 18, 2010
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad design to minimize dielectric cracking
Patent number
7,679,180
Issue date
Mar 16, 2010
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump structure and method of manufacturing same
Patent number
7,659,632
Issue date
Feb 9, 2010
Taiwan Seminconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Seal ring in semiconductor device
Patent number
7,602,065
Issue date
Oct 13, 2009
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump pattern design for flip chip semiconductor package
Patent number
7,446,398
Issue date
Nov 4, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Pao-Kang Niu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad structure and method of forming the same
Patent number
7,148,574
Issue date
Dec 12, 2006
Taiwan Semiconductor Manufacturing Co., Ltd
Jian-Hsing Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of planarization
Patent number
6,277,751
Issue date
Aug 21, 2001
Worldwide Semiconductor Manufacturing Corp.
Pao-Kang Niu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SYSTEM-IN-PACKAGE PACKAGING FOR MINIMIZING BOND WIRE CONTAMINATION...
Publication number
20100164091
Publication date
Jul 1, 2010
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Seal Ring in Semiconductor Device
Publication number
20090140391
Publication date
Jun 4, 2009
Taiwan Semiconductor Manufacturing Co., LTD
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Flip Chip Packages with Spacers Separating Heat Sinks and Substrates
Publication number
20090108429
Publication date
Apr 30, 2009
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming semiconductor ball grid array package
Publication number
20080274569
Publication date
Nov 6, 2008
Taiwan Semiconductor Manufacturing Company, Ltd.
Pei-Haw Tsao
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
System-in-package packaging for minimizing bond wire contamination...
Publication number
20080169557
Publication date
Jul 17, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder bump structure and method of manufacturing same
Publication number
20080122086
Publication date
May 29, 2008
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NOVEL BOND PAD DESIGN TO MINIMIZE DIELECTRIC CRACKING
Publication number
20080122100
Publication date
May 29, 2008
Taiwan Semiconductor Manufacturing Co., LTD
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR BALL GRID ARRAY PACKAGE
Publication number
20080054455
Publication date
Mar 6, 2008
Taiwan Semiconductor Manufacturing Co., LTD
Pei-Haw Tsao
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF
Publication number
20080042269
Publication date
Feb 21, 2008
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Pao-Kang Niu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP PATTERN DESIGN FOR FLIP CHIP SEMICONDUCTOR PACKAGE
Publication number
20080029876
Publication date
Feb 7, 2008
Taiwan Semiconductor Manufacturing Co., LTD
Pao-Kang Niu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package substrate for flip chip packaging
Publication number
20080003803
Publication date
Jan 3, 2008
Pei-Haw Tsao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING PAD STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20070042593
Publication date
Feb 22, 2007
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD,
Jian-Hsing Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding pad structure and method of forming the same
Publication number
20050230847
Publication date
Oct 20, 2005
Jian-Hsing Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Novel formation of an aluminum contact pad free of plasma induced d...
Publication number
20040175918
Publication date
Sep 9, 2004
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Pao-Kang Niu
H01 - BASIC ELECTRIC ELEMENTS