Pao-nan Li

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having impedance matching device
- Patent number 7,948,070
- Issue date May 24, 2011
- Advanced Semiconductor Engineering, Inc.
- Tseng-ying Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPEDANCE MATCHING DEVICE
- Publication number 20080191362
- Publication date Aug 14, 2008
- Advanced Semiconductor Engineering, Inc.
- Tseng-ying Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-chip package substrate with a high-density layout
- Publication number 20050248037
- Publication date Nov 10, 2005
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS