Pao-Tung Chen

Person

Tainan Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for via last through-vias
- Patent number 11,978,758
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 11,791,206
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for via last through-vias
- Patent number 11,600,653
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging device comprising a shield structure
- Patent number 11,552,027
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming hybrid-bonding structure
- Patent number 11,545,443
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC seal ring structure and methods of forming same
- Patent number 11,532,661
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging device comprising a shield structure
- Patent number 11,037,885
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for image sensor packaging
- Patent number 10,930,699
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion through-substrate via
- Patent number 10,867,891
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line design for hybrid-bonding application
- Patent number 10,790,240
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 10,777,539
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and pre-clean apparat...
- Patent number 10,727,118
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC seal ring structure and methods of forming same
- Patent number 10,510,792
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 10,510,791
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for image sensor packaging
- Patent number 10,475,843
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 10,475,772
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for via last through-vias
- Patent number 10,269,863
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 10,157,895
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor chip sidewall interconnection
- Patent number 10,134,794
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 10,062,721
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal-ring structure for stacking integrated circuits
- Patent number 9,972,603
- Issue date May 15, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared image sensor
- Patent number 9,929,198
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Keng-Yu Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods and apparatus for glass removal in CMOS image sensors
- Patent number 9,859,322
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pao-Tung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC seal ring structure and methods of forming same
- Patent number 9,806,119
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,780,134
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kazuaki Hashimoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dual metal for a backside package of backside illuminated image sensor
- Patent number 9,673,246
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor chip sidewall interconnection
- Patent number 9,634,053
- Issue date Apr 25, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ridge structure for back side illuminated image sensor
- Patent number 9,570,503
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with embedded infrared filter layer
- Patent number 9,536,915
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Keng-Yu Chou
- G02 - OPTICS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 9,530,811
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3DIC Seal Ring Structure and Methods of Forming Same
- Publication number 20230106039
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE COMPRISING A SHIELD STRUCTURE
- Publication number 20210296258
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Via Last Through-Vias
- Publication number 20210159264
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION THROUGH-SUBSTRATE VIA
- Publication number 20210082787
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Yang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE COMPRISING A SHIELD STRUCTURE
- Publication number 20210050303
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Yu Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING HYBRID-BONDING STRUCTURE
- Publication number 20210005558
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20200357693
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION THROUGH-SUBSTRATE VIA
- Publication number 20200135617
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Yang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Seal Ring Structure and Methods of Forming Same
- Publication number 20200119074
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Image Sensor Packaging
- Publication number 20200035743
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS
- Publication number 20200027860
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Via Last Through-Vias
- Publication number 20190237505
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PRE-CLEAN APPARAT...
- Publication number 20190164826
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Tang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS
- Publication number 20190109121
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiode with a Stacked Scheme
- Publication number 20190013345
- Publication date Jan 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINE DESIGN FOR HYBRID-BONDING APPLICATION
- Publication number 20180269161
- Publication date Sep 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS
- Publication number 20180233490
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Seal Ring Structure and Methods of Forming Same
- Publication number 20180033817
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CHIP SIDEWALL INTERCONNECTION
- Publication number 20170221952
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS
- Publication number 20170186732
- Publication date Jun 29, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiode with a Stacked Scheme
- Publication number 20170092679
- Publication date Mar 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Image Sensor Packaging
- Publication number 20160254306
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH EMBEDDED INFRARED FILTER LAYER
- Publication number 20160254304
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Keng-Yu CHOU
- G02 - OPTICS
Information Patent Application
Methods and Apparatus for Glass Removal in CMOS Image Sensors
- Publication number 20160197115
- Publication date Jul 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pao-Tung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CHIP SIDEWALL INTERCONNECTION
- Publication number 20160163755
- Publication date Jun 9, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Chin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED IMAGE SENSOR
- Publication number 20160099271
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Keng-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH EMBEDDED INFRARED FILTER LAYER
- Publication number 20160080669
- Publication date Mar 17, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Keng-Yu CHOU
- G02 - OPTICS
Information Patent Application
Elevated Photodiode with a Stacked Scheme
- Publication number 20150372042
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20150334324
- Publication date Nov 19, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- KAZUAKI HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Seal Ring Structure and Methods of Forming Same
- Publication number 20150194455
- Publication date Jul 9, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS

Pao-Tung Chen

Person

Patents Grantslast 30 patents

Methods and apparatus for via last through-vias

Method for forming semiconductor device

Methods and apparatus for via last through-vias

Semiconductor packaging device comprising a shield structure

Method for forming hybrid-bonding structure

3DIC seal ring structure and methods of forming same

Semiconductor packaging device comprising a shield structure

Method and apparatus for image sensor packaging

Ion through-substrate via

Metal line design for hybrid-bonding application

Seal-ring structure for stacking integrated circuits

Method for manufacturing semiconductor device and pre-clean apparat...

3DIC seal ring structure and methods of forming same

Elevated photodiode with a stacked scheme

Method and apparatus for image sensor packaging

Seal-ring structure for stacking integrated circuits

Methods and apparatus for via last through-vias

Seal-ring structure for stacking integrated circuits

Image sensor chip sidewall interconnection

Elevated photodiode with a stacked scheme

Seal-ring structure for stacking integrated circuits

Infrared image sensor

Methods and apparatus for glass removal in CMOS image sensors

3DIC seal ring structure and methods of forming same

Semiconductor device and method of forming the same

Dual metal for a backside package of backside illuminated image sensor

Image sensor chip sidewall interconnection

Ridge structure for back side illuminated image sensor

Image sensor with embedded infrared filter layer

Elevated photodiode with a stacked scheme

Patents Applicationslast 30 patents

3DIC Seal Ring Structure and Methods of Forming Same

SEMICONDUCTOR PACKAGING DEVICE COMPRISING A SHIELD STRUCTURE

Methods and Apparatus for Via Last Through-Vias

ION THROUGH-SUBSTRATE VIA

SEMICONDUCTOR PACKAGING DEVICE COMPRISING A SHIELD STRUCTURE

METHOD FOR FORMING HYBRID-BONDING STRUCTURE

METHOD FOR FORMING SEMICONDUCTOR DEVICE

ION THROUGH-SUBSTRATE VIA

3DIC Seal Ring Structure and Methods of Forming Same

Method and Apparatus for Image Sensor Packaging

SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS

Methods and Apparatus for Via Last Through-Vias

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PRE-CLEAN APPARAT...

SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS

Elevated Photodiode with a Stacked Scheme

METAL LINE DESIGN FOR HYBRID-BONDING APPLICATION

SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS

3DIC Seal Ring Structure and Methods of Forming Same

IMAGE SENSOR CHIP SIDEWALL INTERCONNECTION

SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS

Elevated Photodiode with a Stacked Scheme

Method and Apparatus for Image Sensor Packaging

IMAGE SENSOR WITH EMBEDDED INFRARED FILTER LAYER

Methods and Apparatus for Glass Removal in CMOS Image Sensors

IMAGE SENSOR CHIP SIDEWALL INTERCONNECTION

INFRARED IMAGE SENSOR

IMAGE SENSOR WITH EMBEDDED INFRARED FILTER LAYER

Elevated Photodiode with a Stacked Scheme

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

3DIC Seal Ring Structure and Methods of Forming Same