Paolo Tessariol

Person

Montebelluna, IT

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuitry, memory circuitry comprising strings of memory...
- Patent number 11,961,801
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a memory device and memory device manufact...
- Patent number 11,943,938
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Paolo Fantini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including tiered stacks including conductiv...
- Patent number 11,903,196
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
Information Patent Grant
Device, a method used in forming a circuit structure, a method used...
- Patent number 11,889,695
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,871,572
- Issue date Jan 9, 2024
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,864,387
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical 3D memory device and method for manufacturing the same
- Patent number 11,818,902
- Issue date Nov 14, 2023
- Micron Technology, Inc.
- Paolo Fantini
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic devices, memory devices, and electronic systems
- Patent number 11,818,893
- Issue date Nov 14, 2023
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,792,991
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures, capacitors and methods of forming capacitors
- Patent number 11,784,058
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Eric Freeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,710,724
- Issue date Jul 25, 2023
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including different dielectric structures between blocks
- Patent number 11,700,732
- Issue date Jul 11, 2023
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including data lines on multiple device levels
- Patent number 11,605,588
- Issue date Mar 14, 2023
- Micron Technology, Inc.
- Violante Moschiano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,563,024
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,563,022
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array structures and methods for determination of resistive...
- Patent number 11,557,341
- Issue date Jan 17, 2023
- Micron Technology, Inc.
- Dan Xu
- G11 - INFORMATION STORAGE
Information Patent Grant
Erasing memory
- Patent number 11,514,987
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Giovanni Maria Paolucci
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,514,953
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors having vertical contacts extending through conductive tiers
- Patent number 11,489,038
- Issue date Nov 1, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming memory devices including stair step structures
- Patent number 11,430,734
- Issue date Aug 30, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric extensions in stacked memory arrays
- Patent number 11,424,267
- Issue date Aug 23, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices and memory devices, and...
- Patent number 11,417,676
- Issue date Aug 16, 2022
- Micron Technology, Inc.
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,329,062
- Issue date May 10, 2022
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with symmetrically distributed staircase st...
- Patent number 11,302,634
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,282,815
- Issue date Mar 22, 2022
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming a memory array comprising strings of memory...
- Patent number 11,271,002
- Issue date Mar 8, 2022
- Micron Technology, Inc.
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,244,955
- Issue date Feb 8, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,244,954
- Issue date Feb 8, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, a method used in forming a circuit structure, a method used...
- Patent number 11,177,271
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical 3D memory device and method for manufacturing the same
- Patent number 11,158,673
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Paolo Fantini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS
- Publication number 20240099007
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20240081067
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240079057
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Anna Maria Conti
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICES
- Publication number 20240064990
- Publication date Feb 22, 2024
- Lodestar Licensing Group LLC
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS, AN...
- Publication number 20240057328
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures, Capacitors and Methods of Forming Capacitors
- Publication number 20240038542
- Publication date Feb 1, 2024
- Lodestar Licensing Group LLC
- Eric Freeman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED CAVITIES AND BURIED ETCH STOPS FOR THREE-DIMENSIONAL MEMORY...
- Publication number 20230397422
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CAVITY MERGING FOR ISOLATION REGIONS IN A MEMORY DIE
- Publication number 20230395422
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND MEMORY DEVICE DEVICES AND RELATED ELECTRONIC SYSTEMS
- Publication number 20230361083
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING DIFFERENT DIELECTRIC STRUCTURES BETWEEN BLOCKS
- Publication number 20230345730
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAY HAVING AIR GAPS
- Publication number 20230337441
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Paolo Fantini
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES WITH DIFFERENT STAIRCASED STADIUMS HAVING C...
- Publication number 20230317604
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry Comprising Strings Of Memory Cells And Method Used...
- Publication number 20230255023
- Publication date Aug 10, 2023
- Micron Technology, Inc.
- Lifang Xu
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY ARRAY STRUCTURES AND METHODS OF FORMING MEMORY ARRAY STRUCTURES
- Publication number 20230170016
- Publication date Jun 1, 2023
- Micron Technology, Inc.
- Dan Xu
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20230143406
- Publication date May 11, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230118763
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ERASING MEMORY
- Publication number 20230078036
- Publication date Mar 16, 2023
- Micron Technology, Inc.
- Giovanni Maria Paolucci
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20230065142
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING TIERED STACKS...
- Publication number 20230067814
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Raja Kumar Varma Manthena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS HAVING VERTICAL CONTACTS EXTENDING THROUGH CONDUCTIVE TIERS
- Publication number 20230031083
- Publication date Feb 2, 2023
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, Memory Circuitry Comprising Strings Of Memory...
- Publication number 20230009880
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
- Publication number 20220392914
- Publication date Dec 8, 2022
- Micron Technology, Inc.
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED MEMORY DEVICES...
- Publication number 20220384341
- Publication date Dec 1, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH SYMMETRICALLY DISTRIBUTED FILL MATERIA...
- Publication number 20220230960
- Publication date Jul 21, 2022
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING DIFFERENT DIELECTRIC STRUCTURES BETWEEN BLOCKS
- Publication number 20220223613
- Publication date Jul 14, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING TIERED STACKS INCLUDING CONDUCTIV...
- Publication number 20220199641
- Publication date Jun 23, 2022
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20220157844
- Publication date May 19, 2022
- Micron Technology, Inc.
- M. Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20220149015
- Publication date May 12, 2022
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20220130857
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20220123018
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS

Paolo Tessariol

Person

Patents Grantslast 30 patents

Integrated circuitry, memory circuitry comprising strings of memory...

Method for manufacturing a memory device and memory device manufact...

Microelectronic devices including tiered stacks including conductiv...

Device, a method used in forming a circuit structure, a method used...

Integrated assemblies having vertically-spaced channel material seg...

Memory arrays and methods used in forming a memory array comprising...

Vertical 3D memory device and method for manufacturing the same

Microelectronic devices, memory devices, and electronic systems

Memory arrays and methods used in forming a memory array comprising...

Integrated structures, capacitors and methods of forming capacitors

Methods of forming microelectronic devices, and related microelectr...

Memory device including different dielectric structures between blocks

Memory device including data lines on multiple device levels

Integrated assemblies and methods of forming integrated assemblies

Memory arrays and methods used in forming a memory array comprising...

Memory array structures and methods for determination of resistive...

Erasing memory

Integrated assemblies, and methods of forming integrated assemblies

Capacitors having vertical contacts extending through conductive tiers

Methods of forming memory devices including stair step structures

Dielectric extensions in stacked memory arrays

Methods of forming microelectronic devices and memory devices, and...

Memory arrays and methods used in forming a memory array

Microelectronic devices with symmetrically distributed staircase st...

Methods of forming microelectronic devices, and related microelectr...

Methods used in forming a memory array comprising strings of memory...

Memory arrays and methods used in forming a memory array comprising...

Integrated assemblies having vertically-spaced channel material seg...

Device, a method used in forming a circuit structure, a method used...

Vertical 3D memory device and method for manufacturing the same

Patents Applicationslast 30 patents

MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

MEMORY DEVICES

MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS, AN...

Integrated Structures, Capacitors and Methods of Forming Capacitors

MERGED CAVITIES AND BURIED ETCH STOPS FOR THREE-DIMENSIONAL MEMORY...

SELECTIVE CAVITY MERGING FOR ISOLATION REGIONS IN A MEMORY DIE

3D NAND MEMORY DEVICE DEVICES AND RELATED ELECTRONIC SYSTEMS

MEMORY DEVICE INCLUDING DIFFERENT DIELECTRIC STRUCTURES BETWEEN BLOCKS

MEMORY ARRAY HAVING AIR GAPS

MICROELECTRONIC DEVICES WITH DIFFERENT STAIRCASED STADIUMS HAVING C...

Memory Circuitry Comprising Strings Of Memory Cells And Method Used...

MEMORY ARRAY STRUCTURES AND METHODS OF FORMING MEMORY ARRAY STRUCTURES

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

Integrated Assemblies and Methods of Forming Integrated Assemblies

ERASING MEMORY

Integrated Assemblies, and Methods of Forming Integrated Assemblies

METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING TIERED STACKS...

CAPACITORS HAVING VERTICAL CONTACTS EXTENDING THROUGH CONDUCTIVE TIERS

Integrated Circuitry, Memory Circuitry Comprising Strings Of Memory...

MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS

DEVICES INCLUDING STAIR STEP STRUCTURES, AND RELATED MEMORY DEVICES...

MICROELECTRONIC DEVICES WITH SYMMETRICALLY DISTRIBUTED FILL MATERIA...

MEMORY DEVICE INCLUDING DIFFERENT DIELECTRIC STRUCTURES BETWEEN BLOCKS

MICROELECTRONIC DEVICES INCLUDING TIERED STACKS INCLUDING CONDUCTIV...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...