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Paragkumar Ajaybhai Thadesar
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San Diego, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Package comprising substrate with coupling element for integrated d...
Patent number
12,027,476
Issue date
Jul 2, 2024
QUALCOMM Incorporated
Fnu Suraj Prakash
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package comprising an integrated passive device configured as a cap...
Patent number
12,016,247
Issue date
Jun 18, 2024
QUALCOMM Incorporated
Changhan Hobie Yun
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Metal-insulator-metal (MIM) capacitor structure for layer count red...
Patent number
12,009,292
Issue date
Jun 11, 2024
QUALCOMM Incorporated
Nosun Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tunable circuit including integrated filter circuit coupled to vari...
Patent number
11,770,115
Issue date
Sep 26, 2023
QUALCOMM Incorporated
Changhan Hobie Yun
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Chip modules employing conductive pillars to couple a passive compo...
Patent number
11,728,293
Issue date
Aug 15, 2023
QUALCOMM Incorporated
Changhan Hobie Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, package and/or substrate comprising curved antenna
Patent number
11,658,403
Issue date
May 23, 2023
QUALCOMM Incorporated
Changhan Hobie Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitance fine tuning by fin capacitor design
Patent number
11,515,247
Issue date
Nov 29, 2022
QUALCOMM Incorporated
Nosun Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate comprising capacitor configured for power amplifier outpu...
Patent number
11,502,652
Issue date
Nov 15, 2022
QUALCOMM Incorporated
Daniel Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond inductor structures for flip chip dies
Patent number
11,239,158
Issue date
Feb 1, 2022
QUALCOMM Incorporated
Paragkumar Ajaybhai Thadesar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated device package comprising a real time tunable inductor i...
Patent number
10,879,341
Issue date
Dec 29, 2020
QUALCOMM Incorporated
Young Kyu Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inductors formed with through glass vias
Patent number
10,614,942
Issue date
Apr 7, 2020
QUALCOMM Incorporated
Changhan Hobie Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Close proximity tunable inductive elements
Patent number
10,490,621
Issue date
Nov 26, 2019
QUALCOMM Incorporated
Paragkumar Ajaybhai Thadesar
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE EDGE PROTECTION TO ELIMINATE DIE CHIPPING
Publication number
20230352423
Publication date
Nov 2, 2023
QUALCOMM Incorporated
Sameer Sunil VADHAVKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR PASSIVE AND D...
Publication number
20230230910
Publication date
Jul 20, 2023
QUALCOMM Incorporated
Changhan Hobie YUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING SUBSTRATE WITH COUPLING ELEMENT FOR INTEGRATED D...
Publication number
20230223362
Publication date
Jul 13, 2023
QUALCOMM Incorporated
FNU SURAJ PRAKASH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE FOR LAYER COUNT RED...
Publication number
20230187340
Publication date
Jun 15, 2023
QUALCOMM Incorporated
Nosun PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PASSIVE DEVICES
Publication number
20230082743
Publication date
Mar 16, 2023
RF360 Europe GmbH
Changhan Hobie YUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP MODULES EMPLOYING CONDUCTIVE PILLARS TO COUPLE A PASSIVE COMPO...
Publication number
20220246552
Publication date
Aug 4, 2022
QUALCOMM Incorporated
Changhan Hobie YUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE
Publication number
20220248541
Publication date
Aug 4, 2022
QUALCOMM Incorporated
Daniel Daeik KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITANCE FINE TUNING BY FIN CAPACITOR DESIGN
Publication number
20220223516
Publication date
Jul 14, 2022
QUALCOMM Incorporated
Nosun PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TUNABLE CIRCUIT INCLUDING INTEGRATED FILTER CIRCUIT COUPLED TO VARI...
Publication number
20220123735
Publication date
Apr 21, 2022
QUALCOMM Incorporated
Changhan Hobie Yun
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
PACKAGE COMPRISING AN INTEGRATED PASSIVE DEVICE CONFIGURED AS A CAP...
Publication number
20220069193
Publication date
Mar 3, 2022
QUALCOMM Incorporated
Changhan Hobie YUN
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
DEVICE, PACKAGE AND/OR SUBSTRATE COMPRISING CURVED ANTENNA
Publication number
20220069453
Publication date
Mar 3, 2022
QUALCOMM Incorporated
Changhan Hobie YUN
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
PARTIAL COMPONENT EMBEDDING IN A SUBSTRATE
Publication number
20210375732
Publication date
Dec 2, 2021
QUALCOMM Incorporated
Paragkumar Ajaybhai THADESAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE COMPRISING CAPACITOR CONFIGURED FOR POWER AMPLIFIER OUTPU...
Publication number
20210351750
Publication date
Nov 11, 2021
QUALCOMM Incorporated
Daniel Daeik KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FILTER TECHNOLOGY WITH EMBEDDED DEVICES
Publication number
20200091094
Publication date
Mar 19, 2020
QUALCOMM Incorporated
Changhan Hobie YUN
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
INDUCTORS FORMED WITH THROUGH GLASS VIAS
Publication number
20200020473
Publication date
Jan 16, 2020
QUALCOMM Incorporated
Changhan Hobie YUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE PACKAGE WITH WIRE BOND ASSISTED GROUNDING AND INDUCTORS
Publication number
20170338179
Publication date
Nov 23, 2017
QUALCOMM Incorporated
Paragkumar Ajaybhai THADESAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING A REAL TIME TUNABLE INDUCTOR I...
Publication number
20170207293
Publication date
Jul 20, 2017
QUALCOMM Incorporated
Young Kyu Song
H01 - BASIC ELECTRIC ELEMENTS