Paresh Limaye

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Method for insertion bonding and device thus obtained
- Patent number 9,508,665
- Issue date Nov 29, 2016
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window interposed die packaging
- Patent number 8,907,471
- Issue date Dec 9, 2014
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,450,825
- Issue date May 28, 2013
- IMEC
- Paresh Limaye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Window Interposed Die Packaging
- Publication number 20120280381
- Publication date Nov 8, 2012
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110037179
- Publication date Feb 17, 2011
- IMEC
- Paresh Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INSERTION BONDING AND DEVICE THUS OBTAINED
- Publication number 20110027967
- Publication date Feb 3, 2011
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS