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Singapore, SG
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last 30 patents
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Patent Grant
Packaged device with thermal enhancement and method of packaging
Patent number
6,921,974
Issue date
Jul 26, 2005
United Test & Assembly Center Ltd.
Tan Hien Boon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Packaged device and method of packaging
Publication number
20040188864
Publication date
Sep 30, 2004
United Test & Assembly Center Ltd.
Tan Hien Boon
H01 - BASIC ELECTRIC ELEMENTS