Pascale Gagnon

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Quebec, CA

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Patents Grantslast 30 patents

Information Patent Grant
High-density chip-to-chip interconnection with silicon bridge
- Patent number 10,784,202
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounded lid for micro-electronic assemblies
- Patent number 9,042,120
- Issue date May 26, 2015
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grounded lid for micro-electronic assemblies
- Patent number 8,614,900
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE
- Publication number 20190172787
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES
- Publication number 20140016283
- Publication date Jan 16, 2014
- International Business Machines Corporation
- Martin Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES
- Publication number 20110292621
- Publication date Dec 1, 2011
- International Business Machines Corporation
- Martin Beaumier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR