Patrick A. Coico

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for controlling airflow of directional flow perforated tile
- Patent number 9,402,334
- Issue date Jul 26, 2016
- International Business Machines Corporation
- Patrick A. Coico
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Directly connected heat exchanger tube section and coolant-cooled s...
- Patent number 9,132,519
- Issue date Sep 15, 2015
- Interntional Business Machines Corporation
- Timothy J. Chainer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Directly connected heat exchanger tube section and coolant-cooled s...
- Patent number 8,687,364
- Issue date Apr 1, 2014
- International Business Machines Corporation
- Timothy J. Chainer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to improve thermal dissipation from semiconduc...
- Patent number 7,724,527
- Issue date May 25, 2010
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to provide balanced mechanical loading of devi...
- Patent number 7,518,235
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to improve thermal dissipation from semiconduc...
- Patent number 7,468,886
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,964,885
- Issue date Nov 15, 2005
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus to form a reworkable seal on an electronic module
- Patent number 6,955,543
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparing MCM hat for removal
- Patent number 6,908,025
- Issue date Jun 21, 2005
- Internatioanl Business Machines Corporation
- Patrick A. Coico
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,703,560
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array alignment and engagement design
- Patent number 6,354,844
- Issue date Mar 12, 2002
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant leads for area array surface mounted components
- Patent number 6,339,534
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
One step method for curing and joining BGA solder balls
- Patent number 6,333,209
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,278,184
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical sensing method to place flip chips
- Patent number 6,278,193
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,253,986
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing a thermal path through particles embedded in a...
- Patent number 6,255,139
- Issue date Jul 3, 2001
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal cap with embedded particles
- Patent number 6,111,314
- Issue date Aug 29, 2000
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,070,321
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module adjustment design and process using shims
- Patent number 6,049,456
- Issue date Apr 11, 2000
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low strain seal
- Patent number 5,977,625
- Issue date Nov 2, 1999
- International Business Machines Corporation
- David Linn Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic ball grid array using in-situ solder stretch
- Patent number 5,975,409
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,964,396
- Issue date Oct 12, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer sealants/adhesives and use thereof in electronic package as...
- Patent number 5,773,561
- Issue date Jun 30, 1998
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package with low strain seal
- Patent number 5,723,905
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES
- Publication number 20140090806
- Publication date Apr 3, 2014
- International Business Machines Corporation
- Patrick A. Coico
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED S...
- Publication number 20130174421
- Publication date Jul 11, 2013
- International Business Machines Corporation
- Timothy J. CHAINER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED S...
- Publication number 20130107453
- Publication date May 2, 2013
- International Business Machines Corporation
- Timothy J. CHAINER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES
- Publication number 20130000736
- Publication date Jan 3, 2013
- International Business Machines Corporation
- Patrick A. Coico
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...
- Publication number 20080310117
- Publication date Dec 18, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...
- Publication number 20080218971
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20080076690
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND STRUCTURE TO PROVIDE BALANCED MECHANICAL LOADING OF DEVI...
- Publication number 20060202325
- Publication date Sep 14, 2006
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK
- Publication number 20050066995
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Patrick A. Coico
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND APPARATUS TO FORM A REWORKABLE SEAL ON AN ELECTRONIC MODULE
- Publication number 20050037640
- Publication date Feb 17, 2005
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARING MCM HAT FOR REMOVAL
- Publication number 20040262371
- Publication date Dec 30, 2004
- International Business Machines Corporation
- Patrick A. Coico
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20040141296
- Publication date Jul 22, 2004
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20020050398
- Publication date May 2, 2002
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS

Patrick A. Coico

Person

Patents Grantslast 30 patents

Method for controlling airflow of directional flow perforated tile

Directly connected heat exchanger tube section and coolant-cooled s...

Directly connected heat exchanger tube section and coolant-cooled s...

Method and structure to improve thermal dissipation from semiconduc...

Method and structure to provide balanced mechanical loading of devi...

Method and structure to improve thermal dissipation from semiconduc...

Stress resistant land grid array (LGA) module and method of forming...

Method and apparatus to form a reworkable seal on an electronic module

Preparing MCM hat for removal

Stress resistant land grid array (LGA) module and method of forming...

Land grid array alignment and engagement design

Compliant leads for area array surface mounted components

One step method for curing and joining BGA solder balls

Solder disc connection

Optical sensing method to place flip chips

Solder disc connection

Method for providing a thermal path through particles embedded in a...

Thermal cap with embedded particles

Solder disc connection

Electronic module adjustment design and process using shims

Semiconductor package with low strain seal

Ceramic ball grid array using in-situ solder stretch

Enhanced ceramic ball grid array using in-situ solder stretch with...

Enhanced ceramic ball grid array using in-situ solder stretch with...

Polymer sealants/adhesives and use thereof in electronic package as...

Semiconductor package with low strain seal

Patents Applicationslast 30 patents

ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES

DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED S...

DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED S...

ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES

METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...

METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

METHOD AND STRUCTURE TO PROVIDE BALANCED MECHANICAL LOADING OF DEVI...

NON-HERMETIC ENCAPSULANT REMOVAL FOR MODULE REWORK

METHOD AND APPARATUS TO FORM A REWORKABLE SEAL ON AN ELECTRONIC MODULE

PREPARING MCM HAT FOR REMOVAL

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...