PATRICK ALAN LONEY

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FAIRVIEW PARK, OH, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit having a heat sink coupled to separate ground pl...
- Patent number 10,727,162
- Issue date Jul 28, 2020
- Northrop Grumman Systems Corporation
- Patrick Loney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip device with temperature isolating bump bonds
- Patent number 10,644,218
- Issue date May 5, 2020
- Northrop Grumman Systems Corporation
- Aaron Ashley Hathaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally isolated ground planes with a superconducting electrical...
- Patent number 10,629,535
- Issue date Apr 21, 2020
- Northrop Grumman Systems Corporation
- Patrick Alan Loney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting device with thermally conductive heat sink
- Patent number 10,290,676
- Issue date May 14, 2019
- Northrop Grumman Systems Corporation
- Aaron A. Pesetski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic integrated circuit having a heat sink coupled to separate...
- Patent number 10,229,864
- Issue date Mar 12, 2019
- Northrop Grumman Systems Corporation
- Patrick Loney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE GROUND PLANE THERMAL SINK
- Publication number 20190157184
- Publication date May 23, 2019
- Northrop Grumman Systems Corporation
- PATRICK LONEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ISOLATED GROUND PLANES WITH A SUPERCONDUCTING ELECTRICAL...
- Publication number 20190131246
- Publication date May 2, 2019
- Northrop Grumman Systems Corporation
- PATRICK ALAN LONEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cryogenic Integrated Circuit having a Heat Sink coupled to Separate...
- Publication number 20190080983
- Publication date Mar 14, 2019
- Northrop Grumman Systems Corporation
- PATRICK LONEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING DEVICE WITH THERMALLY CONDUCTIVE HEAT SINK
- Publication number 20190058005
- Publication date Feb 21, 2019
- Northrop Grumman Systems Corporation
- AARON A. PESETSKI
- H01 - BASIC ELECTRIC ELEMENTS