Patrick Digamon Bugayong

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Mandaluyong City, PH

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Patents Grantslast 30 patents

Information Patent Grant
Multiple chip module and package stacking method for storage devices
- Patent number 8,093,103
- Issue date Jan 10, 2012
- BiTMICRO NETWORKS, Inc.
- Rey H. Bruce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module and package stacking for storage devices
- Patent number 7,826,243
- Issue date Nov 2, 2010
- BiTMICRO NETWORKS, Inc.
- Rey Bruce
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multiple chip module and package stacking method for storage devices
- Publication number 20070158808
- Publication date Jul 12, 2007
- Rey Bruce
- H01 - BASIC ELECTRIC ELEMENTS