Patrick Fay

Person

Granger, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Core-shell nanofin vertical switch and high-voltage switching
- Patent number 12,009,418
- Issue date Jun 11, 2024
- GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY O...
- Kristine Ann Bertness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-Nitride compound heterojunction tunnel field-effect trans...
- Patent number 9,954,085
- Issue date Apr 24, 2018
- University of Notre Dame due Lac
- Patrick Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-nitride compound heterojunction tunnel field-effect trans...
- Patent number 9,905,647
- Issue date Feb 27, 2018
- University of Notre Dame Du Lac
- Patrick Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for inter-chip communication
- Patent number 9,633,976
- Issue date Apr 25, 2017
- University of Notre Dame Du Lac
- Gary H. Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low voltage tunnel field-effect transistor (TFET) and method of mak...
- Patent number 8,796,733
- Issue date Aug 5, 2014
- University of Notre Dame du Lac
- Alan C. Seabaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-chip communication
- Patent number 8,623,700
- Issue date Jan 7, 2014
- University of Notre Dame du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for antimonide-based backward diode millimete...
- Patent number 8,592,859
- Issue date Nov 26, 2013
- University of Notre Dame du Lac
- Patrick Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-chip communication
- Patent number 8,021,965
- Issue date Sep 20, 2011
- University of Norte Dame Du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inter-chip communication
- Patent number 7,612,443
- Issue date Nov 3, 2009
- University of Notre Dame du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect packaging systems
- Patent number 7,608,919
- Issue date Oct 27, 2009
- University of Notre Dame du Lac
- Gary H. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CORE-SHELL NANOFIN VERTICAL SWITCH AND HIGH-VOLTAGE SWITCHING
- Publication number 20230060711
- Publication date Mar 2, 2023
- Government of the United States of America, as Represented by the Secretary o...
- Kristine Ann Bertness
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE COMPOUND HETEROJUNCTION TUNNEL FIELD-EFFECT TRANS...
- Publication number 20170125521
- Publication date May 4, 2017
- UNIVERSITY OF NOTRE DAME DU LAC
- Patrick Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE COMPOUND HETEROJUNCTION TUNNEL FIELD-EFFECT TRANS...
- Publication number 20170125555
- Publication date May 4, 2017
- UNIVERSITY OF NOTRE DAME DU LAC
- Patrick Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOLTAGE TUNNEL FIELD-EFFECT TRANSISTOR (TFET) AND METHOD OF MAK...
- Publication number 20120032227
- Publication date Feb 9, 2012
- UNIVERSITY OF NOTRE DAME DU LAC
- Alan C. SEABAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR ANTIMONIDE-BASED BACKWARD DIODE MILLIMETE...
- Publication number 20110186906
- Publication date Aug 4, 2011
- Patrick Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patrick Fay

Person

Patents Grantslast 30 patents

Core-shell nanofin vertical switch and high-voltage switching

Group III-Nitride compound heterojunction tunnel field-effect trans...

Group III-nitride compound heterojunction tunnel field-effect trans...

Systems and methods for inter-chip communication

Low voltage tunnel field-effect transistor (TFET) and method of mak...

Inter-chip communication

Methods and apparatus for antimonide-based backward diode millimete...

Inter-chip communication

Inter-chip communication

Interconnect packaging systems

Patents Applicationslast 30 patents

CORE-SHELL NANOFIN VERTICAL SWITCH AND HIGH-VOLTAGE SWITCHING

GROUP III-NITRIDE COMPOUND HETEROJUNCTION TUNNEL FIELD-EFFECT TRANS...

GROUP III-NITRIDE COMPOUND HETEROJUNCTION TUNNEL FIELD-EFFECT TRANS...

LOW VOLTAGE TUNNEL FIELD-EFFECT TRANSISTOR (TFET) AND METHOD OF MAK...

METHODS AND APPARATUS FOR ANTIMONIDE-BASED BACKWARD DIODE MILLIMETE...