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PATRICK GORUN
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BURLINGTON, VT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for thermal-slide debonding of temporary bonded semiconducto...
Patent number
9,281,229
Issue date
Mar 8, 2016
Suss MicroTec Lithography GmbH
Gregory George
B32 - LAYERED PRODUCTS
Information
Patent Grant
Apparatus for thermal-slide debonding of temporary bonded semicondu...
Patent number
8,919,412
Issue date
Dec 30, 2014
Suss Microtec Lithography, GmbH
Gregory George
B32 - LAYERED PRODUCTS
Information
Patent Grant
Apparatus for mechanically debonding temporary bonded semiconductor...
Patent number
8,267,143
Issue date
Sep 18, 2012
Suss Microtec Lithography, GmbH
Gregory George
B32 - LAYERED PRODUCTS
Information
Patent Grant
Apparatus for temporary wafer bonding and debonding
Patent number
8,181,688
Issue date
May 22, 2012
Suss Microtec Lithography, GmbH
Hale Johnson
B32 - LAYERED PRODUCTS
Information
Patent Grant
Apparatus and method for semiconductor wafer bumping via injection...
Patent number
7,703,658
Issue date
Apr 27, 2010
Suss Microtec AG
G. Gerard Gormley
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTO...
Publication number
20150083342
Publication date
Mar 26, 2015
SUSS MICROTEC LITHOGRAPHY, GMBH
GREGORY GEORGE
B32 - LAYERED PRODUCTS
Information
Patent Application
APPARATUS FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDU...
Publication number
20110010908
Publication date
Jan 20, 2011
SUSS MICROTEC INC
GREGORY GEORGE
B32 - LAYERED PRODUCTS
Information
Patent Application
APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
Publication number
20110014774
Publication date
Jan 20, 2011
SUSS MICROTEC INC
HALE JOHNSON
B32 - LAYERED PRODUCTS
Information
Patent Application
APPARATUS FOR MECHANICALLY DEBONDING TEMPORARY BONDED SEMICONDUCTOR...
Publication number
20100263794
Publication date
Oct 21, 2010
SUSS MICROTEC INC
GREGORY GEORGE
B32 - LAYERED PRODUCTS
Information
Patent Application
APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION...
Publication number
20080237315
Publication date
Oct 2, 2008
SUSS MICROTEC AG
G. GERARD GORMLEY
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