Patrick Guay

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Methods for assembling semiconductor devices and interposers
- Patent number 7,528,007
- Issue date May 5, 2009
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers with receptacles for receiving semiconductor devices an...
- Patent number 7,274,095
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array interposer, packages and methods
- Patent number 6,746,894
- Issue date Jun 8, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
U-shape tape for BOC FBGA package to improve moldability
- Patent number 6,617,201
- Issue date Sep 9, 2003
- Micron Technology, Inc.
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
U-shape tape for BOC FBGA package to improve moldability
- Patent number 6,486,536
- Issue date Nov 26, 2002
- Micron Technology, Inc.
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods for assembling semiconductor devices and interposers
- Publication number 20060194373
- Publication date Aug 31, 2006
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20040217459
- Publication date Nov 4, 2004
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
U-shape tape for BOC FBGA package to improve moldability
- Publication number 20030025185
- Publication date Feb 6, 2003
- Lim T. Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20020142513
- Publication date Oct 3, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS