Patrick H. Buffet

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Validation of electrical performance of an electronic package prior...
- Patent number 7,454,723
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit chip having a ringed wiring layer interposed bet...
- Patent number 7,146,596
- Issue date Dec 5, 2006
- International Business Machines Corporation
- Thomas R. Bednar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for locating IDDQ defects using multiple controlled collapse...
- Patent number 7,064,570
- Issue date Jun 20, 2006
- International Business Machines, Corporation
- Patrick H. Buffet
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method to reduce signal cross-talk
- Patent number 7,038,319
- Issue date May 2, 2006
- International Business Machines Corporation
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent electrical signal wiring optimization for an electronic...
- Patent number 7,017,128
- Issue date Mar 21, 2006
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Efficient and comprehensive method to calculate IC package or PCB t...
- Patent number 7,000,203
- Issue date Feb 14, 2006
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Validation of electrical performance of an electronic package prior...
- Patent number 6,978,214
- Issue date Dec 20, 2005
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power switch circuit sizing technique
- Patent number 6,924,661
- Issue date Aug 2, 2005
- International Business Machines Corporation
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having high density signal wires with low resist...
- Patent number 6,762,367
- Issue date Jul 13, 2004
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concurrent electrical signal wiring optimization for an electronic...
- Patent number 6,703,706
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for locating IDDQ defects using multiple controlled collapse...
- Patent number 6,677,774
- Issue date Jan 13, 2004
- International Business Machines Corporation
- Patrick H. Buffet
- G01 - MEASURING TESTING
Information Patent Grant
Method of analyzing integrated circuit power distribution in chips...
- Patent number 6,631,502
- Issue date Oct 7, 2003
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for specifying, identifying, selecting or verifying differen...
- Patent number 6,606,732
- Issue date Aug 12, 2003
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit bus grid having wires with pre-selected variable...
- Patent number 6,586,828
- Issue date Jul 1, 2003
- International Business Machines Corporation
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of designing a voltage partitioned solder-bump package
- Patent number 6,584,596
- Issue date Jun 24, 2003
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power grid wiring for semiconductor devices having voltage islands
- Patent number 6,538,314
- Issue date Mar 25, 2003
- International Business Machines Corporation
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of designing a voltage partitioned wirebond package
- Patent number 6,523,150
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of assigning integrated circuit I/O signals in an integrated...
- Patent number 6,499,134
- Issue date Dec 24, 2002
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Scalable high frequency integrated circuit package
- Patent number 6,495,911
- Issue date Dec 17, 2002
- International Business Machines Corporation
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMC protection in digital computers
- Patent number 6,483,720
- Issue date Nov 19, 2002
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High frequency de-coupling via short circuits
- Patent number 6,477,057
- Issue date Nov 5, 2002
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
VALIDATION OF ELECTRICAL PERFORMANCE OF AN ELECTRONIC PACKAGE PRIOR...
- Publication number 20080320424
- Publication date Dec 25, 2008
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Validation of electrical performance of an electronic package prior...
- Publication number 20060036981
- Publication date Feb 16, 2006
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Validation of electrical performance of an electronic package prior...
- Publication number 20050114050
- Publication date May 26, 2005
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EFFICIENT AND COMPREHENSIVE METHOD TO CALCULATE IC PACKAGE OR PCB T...
- Publication number 20050102641
- Publication date May 12, 2005
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Chip Having A Ringed Wiring Layer Interposed Bet...
- Publication number 20050050505
- Publication date Mar 3, 2005
- International Business Machines Corporation
- Thomas R. Bednar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method to reduce signal cross-talk
- Publication number 20050040536
- Publication date Feb 24, 2005
- International Business Machines Corporation
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SWITCH CIRCUIT SIZING TECHNIQUE
- Publication number 20040155681
- Publication date Aug 12, 2004
- International Business Machines Corporation
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concurrent electrical signal wiring optimization for an electronic...
- Publication number 20040132229
- Publication date Jul 8, 2004
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for locating IDDQ defects using multiple controlled collapse...
- Publication number 20040061519
- Publication date Apr 1, 2004
- Patrick H. Buffet
- G01 - MEASURING TESTING
Information Patent Application
METHOD TO OBTAIN HIGH DENSITY SIGNAL WIRES WITH LOW RESISTANCE IN A...
- Publication number 20040050585
- Publication date Mar 18, 2004
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of analyzing integrated circuit power distribution in chips...
- Publication number 20030135830
- Publication date Jul 17, 2003
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Concurrent electrical signal wiring optimization for an electronic...
- Publication number 20030127728
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT BUS GRID HAVING WIRES WITH PRE-SELECTED VARIABLE...
- Publication number 20030071343
- Publication date Apr 17, 2003
- International Business Machines Corporation
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DESIGNING A VOLTAGE PARTITIONED SOLDER-BUMP PACKAGE
- Publication number 20030061571
- Publication date Mar 27, 2003
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for locating IDDQ defects using multiple controlled collapse...
- Publication number 20020196042
- Publication date Dec 26, 2002
- Patrick H. Buffet
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing a scalable high frequency integrated circu...
- Publication number 20020186554
- Publication date Dec 12, 2002
- Patrick H. Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for specifying, identifying, selecting or verifying differen...
- Publication number 20020073384
- Publication date Jun 13, 2002
- International Business Machines Corporation
- Patrick H. Buffet
- G06 - COMPUTING CALCULATING COUNTING

Patrick H. Buffet

Person

Patents Grantslast 30 patents

Validation of electrical performance of an electronic package prior...

Integrated circuit chip having a ringed wiring layer interposed bet...

Method for locating IDDQ defects using multiple controlled collapse...

Apparatus and method to reduce signal cross-talk

Concurrent electrical signal wiring optimization for an electronic...

Efficient and comprehensive method to calculate IC package or PCB t...

Validation of electrical performance of an electronic package prior...

Power switch circuit sizing technique

Electronic package having high density signal wires with low resist...

Concurrent electrical signal wiring optimization for an electronic...

Method for locating IDDQ defects using multiple controlled collapse...

Method of analyzing integrated circuit power distribution in chips...

Method for specifying, identifying, selecting or verifying differen...

Integrated circuit bus grid having wires with pre-selected variable...

Method of designing a voltage partitioned solder-bump package

Power grid wiring for semiconductor devices having voltage islands

Method of designing a voltage partitioned wirebond package

Method of assigning integrated circuit I/O signals in an integrated...

Scalable high frequency integrated circuit package

EMC protection in digital computers

High frequency de-coupling via short circuits

Patents Applicationslast 30 patents

VALIDATION OF ELECTRICAL PERFORMANCE OF AN ELECTRONIC PACKAGE PRIOR...

Validation of electrical performance of an electronic package prior...

Validation of electrical performance of an electronic package prior...

EFFICIENT AND COMPREHENSIVE METHOD TO CALCULATE IC PACKAGE OR PCB T...

Integrated Circuit Chip Having A Ringed Wiring Layer Interposed Bet...

Apparatus and method to reduce signal cross-talk

POWER SWITCH CIRCUIT SIZING TECHNIQUE

Concurrent electrical signal wiring optimization for an electronic...

Method for locating IDDQ defects using multiple controlled collapse...

METHOD TO OBTAIN HIGH DENSITY SIGNAL WIRES WITH LOW RESISTANCE IN A...

Method of analyzing integrated circuit power distribution in chips...

Concurrent electrical signal wiring optimization for an electronic...

INTEGRATED CIRCUIT BUS GRID HAVING WIRES WITH PRE-SELECTED VARIABLE...

METHOD OF DESIGNING A VOLTAGE PARTITIONED SOLDER-BUMP PACKAGE

Method for locating IDDQ defects using multiple controlled collapse...

Method for manufacturing a scalable high frequency integrated circu...

Method for specifying, identifying, selecting or verifying differen...