Patrick J. Carberry

Person

Laury's Station, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical devices having adjustable capacitance
- Patent number 7,960,812
- Issue date Jun 14, 2011
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for encapsulated semiconductor devices and method of makin...
- Patent number 7,956,451
- Issue date Jun 7, 2011
- Agere Systems Inc.
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with base features to reduce leakage
- Patent number 7,541,669
- Issue date Jun 2, 2009
- Agere Systems Inc.
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices having adjustable electrical characteristics
- Patent number 7,456,716
- Issue date Nov 25, 2008
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages having stable wirebonds
- Patent number 7,314,781
- Issue date Jan 1, 2008
- LSI Corporation
- Brett J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with reduced leakage
- Patent number 7,224,047
- Issue date May 29, 2007
- LSI Corporation
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for integrated circuit ball bonding using sta...
- Patent number 7,009,305
- Issue date Mar 7, 2006
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL DEVICES HAVING ADJUSTABLE CAPACITANCE
- Publication number 20090040683
- Publication date Feb 12, 2009
- Agere Systems Inc.
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with base features to reduce leakage
- Publication number 20070241433
- Publication date Oct 18, 2007
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device having encapsulant dam with chamfered edge
- Publication number 20060170079
- Publication date Aug 3, 2006
- John McKenna Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device packages having stable wirebonds
- Publication number 20060172456
- Publication date Aug 3, 2006
- Brett J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe designs for plastic cavity transistor packages
- Publication number 20060145317
- Publication date Jul 6, 2006
- John M. Brennan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for encapsulated semiconductor devices and method of makin...
- Publication number 20060131704
- Publication date Jun 22, 2006
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with reduced leakage
- Publication number 20060131707
- Publication date Jun 22, 2006
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR INTEGRATED CIRCUIT BALL BONDING USING STA...
- Publication number 20060001157
- Publication date Jan 5, 2006
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical devices having adjustable electrical characteristics
- Publication number 20050146413
- Publication date Jul 7, 2005
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for fabricating a power hybrid module
- Publication number 20040212081
- Publication date Oct 28, 2004
- Patrick J. Carberry
- H01 - BASIC ELECTRIC ELEMENTS

Patrick J. Carberry

Person

Patents Grantslast 30 patents

Electrical devices having adjustable capacitance

Packages for encapsulated semiconductor devices and method of makin...

Semiconductor device package with base features to reduce leakage

Electrical devices having adjustable electrical characteristics

Device packages having stable wirebonds

Semiconductor device package with reduced leakage

Methods and apparatus for integrated circuit ball bonding using sta...

Patents Applicationslast 30 patents

ELECTRICAL DEVICES HAVING ADJUSTABLE CAPACITANCE

Semiconductor device package with base features to reduce leakage

Integrated circuit device having encapsulant dam with chamfered edge

Device packages having stable wirebonds

Leadframe designs for plastic cavity transistor packages

Packages for encapsulated semiconductor devices and method of makin...

Semiconductor device package with reduced leakage

METHODS AND APPARATUS FOR INTEGRATED CIRCUIT BALL BONDING USING STA...

Electrical devices having adjustable electrical characteristics

Process for fabricating a power hybrid module