Patrick M. Paluda

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 7,855,103
- Issue date Dec 21, 2010
- Intel Corporation
- Robert J. Gleixner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 7,393,772
- Issue date Jul 1, 2008
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 6,924,554
- Issue date Aug 2, 2005
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 6,683,383
- Issue date Jan 27, 2004
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE
- Publication number 20080227285
- Publication date Sep 18, 2008
- ROBERT J. GLEIXNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebond structure and method to connect to a microelectronic die
- Publication number 20050079651
- Publication date Apr 14, 2005
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebond structure and method to connect to a microelectronic die
- Publication number 20030205827
- Publication date Nov 6, 2003
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebond structure and method to connect to a microelectronic die
- Publication number 20030075804
- Publication date Apr 24, 2003
- Intel Corporation
- Robert J. Gleixner
- H01 - BASIC ELECTRIC ELEMENTS