Patrick N. Stover

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Soldering a die to a substrate
- Patent number 7,332,423
- Issue date Feb 19, 2008
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE
- Publication number 20230197659
- Publication date Jun 22, 2023
- Intel Corporation
- Mukund Ayalasomayajula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...
- Publication number 20160268213
- Publication date Sep 15, 2016
- Intel Corporation
- Hongjin JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE/HIGH TEMPERATURE SOLDER HYBRID SOLDER INTERCONNECTS
- Publication number 20140151096
- Publication date Jun 5, 2014
- Hongjin Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering a die to a substrate
- Publication number 20070001318
- Publication date Jan 4, 2007
- Robert Starkston
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...