Patrick NARDI

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Foam composite
- Patent number 10,651,108
- Issue date May 12, 2020
- Intel Corporation
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic package that includes multi-layer stiffener
- Patent number 10,535,615
- Issue date Jan 14, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constrained cure component attach process for improved IC package w...
- Patent number 10,290,569
- Issue date May 14, 2019
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and method of connecting a first die to a second...
- Patent number 9,887,104
- Issue date Feb 6, 2018
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel level fabrication of package substrates with integrated stiff...
- Patent number 9,832,860
- Issue date Nov 28, 2017
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming serpentine thermal interface material and struct...
- Patent number 9,418,912
- Issue date Aug 16, 2016
- Intel Corporation
- Patrick Nardi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Methods of forming serpentine thermal interface material and struct...
- Patent number 9,230,877
- Issue date Jan 5, 2016
- Intel Corporation
- Patrick Nardi
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH...
- Publication number 20230307379
- Publication date Sep 28, 2023
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PACKAGE STIFFENERS OF METAL ALLOYS HAVING EX...
- Publication number 20220285288
- Publication date Sep 8, 2022
- Intel Corporation
- Valery Ouvarov-Bancalero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...
- Publication number 20190103345
- Publication date Apr 4, 2019
- Intel Corporation
- Kyle YAZZIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES MULTI-LAYER STIFFENER
- Publication number 20180033741
- Publication date Feb 1, 2018
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOAM COMPOSITE
- Publication number 20180005917
- Publication date Jan 4, 2018
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING OF ELECTRONICS USING FOLDED FOIL MICROCHANNELS
- Publication number 20170186667
- Publication date Jun 29, 2017
- Intel Corporation
- Arnab Choudhury
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADAPTIVE TCB BY DATA FEED FORWARD
- Publication number 20170154828
- Publication date Jun 1, 2017
- Intel Corporation
- Timothy A. GOSSELIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PANEL LEVEL FABRICATION OF PACKAGE SUBSTRATES WITH INTEGRATED STIFF...
- Publication number 20160095209
- Publication date Mar 31, 2016
- Intel Corporation
- Robert STARKSTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCT...
- Publication number 20160079141
- Publication date Mar 17, 2016
- Intel Corporation
- Patrick Nardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF CONNECTING A FIRST DIE TO A SECOND...
- Publication number 20160005672
- Publication date Jan 7, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCT...
- Publication number 20140177166
- Publication date Jun 26, 2014
- Patrick Nardi
- F28 - HEAT EXCHANGE IN GENERAL

Patrick NARDI

Person

Patents Grantslast 30 patents

Foam composite

Electronic package that includes multi-layer stiffener

Constrained cure component attach process for improved IC package w...

Electronic package and method of connecting a first die to a second...

Panel level fabrication of package substrates with integrated stiff...

Methods of forming serpentine thermal interface material and struct...

Methods of forming serpentine thermal interface material and struct...

Patents Applicationslast 30 patents

BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH...

INTEGRATED CIRCUIT DIE PACKAGE STIFFENERS OF METAL ALLOYS HAVING EX...

CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...

ELECTRONIC PACKAGE THAT INCLUDES MULTI-LAYER STIFFENER

FOAM COMPOSITE

COOLING OF ELECTRONICS USING FOLDED FOIL MICROCHANNELS

ADAPTIVE TCB BY DATA FEED FORWARD

PANEL LEVEL FABRICATION OF PACKAGE SUBSTRATES WITH INTEGRATED STIFF...

METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCT...

ELECTRONIC PACKAGE AND METHOD OF CONNECTING A FIRST DIE TO A SECOND...

METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCT...