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Patrick R. Zippetelli
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Endwell, NY, US
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last 30 patents
Information
Patent Grant
Integrated circuit package
Patent number
6,226,187
Issue date
May 1, 2001
International Business Machines Corporation
David Lee Questad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package including a heat sink and an adhesive
Patent number
6,084,299
Issue date
Jul 4, 2000
International Business Machines Corporation
David Lee Questad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual substrate package assembly having dielectric member engaging c...
Patent number
6,046,911
Issue date
Apr 4, 2000
International Business Machines Corporation
David William Dranchak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual substrate package assembly coupled to a conducting member
Patent number
5,953,214
Issue date
Sep 14, 1999
International Business Machines Corporation
David William Dranchak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite for providing a rigid-flexible circuit board construction...
Patent number
5,378,306
Issue date
Jan 3, 1995
International Business Machines Corporation
Michael J. Cibulsky
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Composite for providing a rigid-flexible circuit board construction...
Patent number
5,288,542
Issue date
Feb 22, 1994
International Business Machines Corporation
Michael J. Cibulsky
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR