Patrick R. Zippetelli

Person

Endwell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package
- Patent number 6,226,187
- Issue date May 1, 2001
- International Business Machines Corporation
- David Lee Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including a heat sink and an adhesive
- Patent number 6,084,299
- Issue date Jul 4, 2000
- International Business Machines Corporation
- David Lee Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual substrate package assembly having dielectric member engaging c...
- Patent number 6,046,911
- Issue date Apr 4, 2000
- International Business Machines Corporation
- David William Dranchak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual substrate package assembly coupled to a conducting member
- Patent number 5,953,214
- Issue date Sep 14, 1999
- International Business Machines Corporation
- David William Dranchak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite for providing a rigid-flexible circuit board construction...
- Patent number 5,378,306
- Issue date Jan 3, 1995
- International Business Machines Corporation
- Michael J. Cibulsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite for providing a rigid-flexible circuit board construction...
- Patent number 5,288,542
- Issue date Feb 22, 1994
- International Business Machines Corporation
- Michael J. Cibulsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patrick R. Zippetelli

Person

Patents Grantslast 30 patents

Integrated circuit package

Integrated circuit package including a heat sink and an adhesive

Dual substrate package assembly having dielectric member engaging c...

Dual substrate package assembly coupled to a conducting member

Composite for providing a rigid-flexible circuit board construction...

Composite for providing a rigid-flexible circuit board construction...