Patrick W. Tandy

Person

Bosie, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of operating electronic devices, and methods of providing e...
- Patent number 8,554,166
- Issue date Oct 8, 2013
- Round Rock Research, LLC
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of operating electronic devices, and methods of providing e...
- Patent number 8,036,629
- Issue date Oct 11, 2011
- Round Rock Research, LLC
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solder ball landpad design to improve laminate performance
- Patent number 7,951,646
- Issue date May 31, 2011
- Round Rock Research, LLC
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating electronic devices, and methods of providing e...
- Patent number 7,778,621
- Issue date Aug 17, 2010
- Round Rock Research, LLC
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of operating electronic devices, and methods of providing e...
- Patent number 7,593,708
- Issue date Sep 22, 2009
- Keystone Technology Solutions, LLC
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming a non-continuous conductive layer for laminated s...
- Patent number 7,216,425
- Issue date May 15, 2007
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of operating microelectronic devices, and methods of provid...
- Patent number 7,107,019
- Issue date Sep 12, 2006
- Micron Technology, Inc.
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mold assembly for a package stack via bottom-leaded plastic (BLP) p...
- Patent number 7,094,046
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectively coating bond pads
- Patent number 6,998,714
- Issue date Feb 14, 2006
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball landpad design to improve laminate performance
- Patent number 6,914,326
- Issue date Jul 5, 2005
- Micron Technology, Inc.
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold assembly for a package stack via bottom-leaded plastic (blp) p...
- Patent number 6,899,534
- Issue date May 31, 2005
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for marking defective sections of laminate sub...
- Patent number 6,756,606
- Issue date Jun 29, 2004
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a non-continuous conductive layer for laminated s...
- Patent number 6,729,024
- Issue date May 4, 2004
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-continuous conductive layer for laminated substrates
- Patent number 6,727,437
- Issue date Apr 27, 2004
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of operating microelectronic devices, and methods of provid...
- Patent number 6,718,163
- Issue date Apr 6, 2004
- Micron Technology, Inc.
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package with molded flash
- Patent number 6,660,558
- Issue date Dec 9, 2003
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling die package
- Patent number 6,658,727
- Issue date Dec 9, 2003
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression layer on the lead frame to reduce stress defects
- Patent number 6,657,288
- Issue date Dec 2, 2003
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball landpad design to improve laminate performance
- Patent number 6,577,004
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling a stacked die package
- Patent number 6,553,658
- Issue date Apr 29, 2003
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, methods of operating microelectronic devic...
- Patent number 6,542,720
- Issue date Apr 1, 2003
- Micron Technology, Inc.
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Encapsulation mold with a castellated inner surface
- Patent number 6,537,051
- Issue date Mar 25, 2003
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlling packaging encapsulant leakage
- Patent number 6,521,980
- Issue date Feb 18, 2003
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling a stacked die package
- Patent number 6,499,213
- Issue date Dec 31, 2002
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression layer on the leadframe to reduce stress defects
- Patent number 6,486,539
- Issue date Nov 26, 2002
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-continuous conductive layer for laminated substrates
- Patent number 6,429,385
- Issue date Aug 6, 2002
- Micron Technology, Inc.
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectively coating bond pads
- Patent number 6,403,457
- Issue date Jun 11, 2002
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test contact
- Patent number 6,404,216
- Issue date Jun 11, 2002
- Micron Technology, Inc.
- Patrick W. Tandy
- G01 - MEASURING TESTING
Information Patent Grant
Controlling packaging encapsulant leakage
- Patent number 6,395,579
- Issue date May 28, 2002
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate having through hole markings to indica...
- Patent number 6,392,289
- Issue date May 21, 2002
- Micron Technology, Inc.
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF OPERATING ELECTRONIC DEVICES, AND METHODS OF PROVIDING E...
- Publication number 20120028582
- Publication date Feb 2, 2012
- ROUND ROCK RESEARCH, LLC
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS OF OPERATING ELECTRONIC DEVICES, AND METHODS OF PROVIDING E...
- Publication number 20100323656
- Publication date Dec 23, 2010
- ROUND ROCK RESEARCH, LLC
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Methods of Operating Electronic Devices, and Methods of Providing E...
- Publication number 20070298730
- Publication date Dec 27, 2007
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF FORMING A NON-CONTINUOUS CONDUCTIVE LAYER FOR LAMINATED S...
- Publication number 20070134952
- Publication date Jun 14, 2007
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of operating electronic devices, and methods of providing e...
- Publication number 20060293019
- Publication date Dec 28, 2006
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Mold assembly, method and a package stack via bottom-leaded plastic...
- Publication number 20060118938
- Publication date Jun 8, 2006
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selectively coating bond pads
- Publication number 20060030147
- Publication date Feb 9, 2006
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold assembly for a package stack via bottom-leaded plastic (BLP) p...
- Publication number 20050242421
- Publication date Nov 3, 2005
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of operating microelectronic devices, and methods of provid...
- Publication number 20040256722
- Publication date Dec 23, 2004
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of forming a non-continuous conductive layer for laminated s...
- Publication number 20040172821
- Publication date Sep 9, 2004
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selectively coating bond pads
- Publication number 20040150106
- Publication date Aug 5, 2004
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball landpad design to improve laminate performance
- Publication number 20030205807
- Publication date Nov 6, 2003
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder ball landpad design to improve laminate performance
- Publication number 20030193089
- Publication date Oct 16, 2003
- Brad D. Rumsey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of operating microelectronic devices, and methods of provid...
- Publication number 20030129951
- Publication date Jul 10, 2003
- Patrick W. Tandy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Package stack via bottom-leaded plastic (BLP) packaging
- Publication number 20030129271
- Publication date Jul 10, 2003
- Patrick W. Tandy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for assembling die package
- Publication number 20030101583
- Publication date Jun 5, 2003
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compression layer on the leadframe to reduce stress defects
- Publication number 20030001246
- Publication date Jan 2, 2003
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-continuous conductive layer for laminated substrates
- Publication number 20020189851
- Publication date Dec 19, 2002
- Patrick W. Tandy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Apparatus and method for marking defective sections of laminate sub...
- Publication number 20020050591
- Publication date May 2, 2002
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a non-continuous conductive layer for laminated s...
- Publication number 20020017396
- Publication date Feb 14, 2002
- Patrick W. Tandy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SELECTIVELY COATING BOND PADS
- Publication number 20020011666
- Publication date Jan 31, 2002
- PATRICK W. TANDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package stack via bottom leaded plastic (BLP) packaging
- Publication number 20010012526
- Publication date Aug 9, 2001
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling packaging encapsulant leakage
- Publication number 20010008780
- Publication date Jul 19, 2001
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembling a stacked die package
- Publication number 20010005935
- Publication date Jul 5, 2001
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembling a stacked die package
- Publication number 20010004802
- Publication date Jun 28, 2001
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively coating bond pads
- Publication number 20010002734
- Publication date Jun 7, 2001
- Patrick W. Tandy
- H01 - BASIC ELECTRIC ELEMENTS

Patrick W. Tandy

Person

Patents Grantslast 30 patents

Methods of operating electronic devices, and methods of providing e...

Methods of operating electronic devices, and methods of providing e...

Solder ball landpad design to improve laminate performance

Methods of operating electronic devices, and methods of providing e...

Methods of operating electronic devices, and methods of providing e...

Method of forming a non-continuous conductive layer for laminated s...

Methods of operating microelectronic devices, and methods of provid...

Mold assembly for a package stack via bottom-leaded plastic (BLP) p...

Selectively coating bond pads

Solder ball landpad design to improve laminate performance

Mold assembly for a package stack via bottom-leaded plastic (blp) p...

Apparatus and method for marking defective sections of laminate sub...

Method of forming a non-continuous conductive layer for laminated s...

Non-continuous conductive layer for laminated substrates

Methods of operating microelectronic devices, and methods of provid...

Semiconductor package with molded flash

Method for assembling die package

Compression layer on the lead frame to reduce stress defects

Solder ball landpad design to improve laminate performance

Assembling a stacked die package

Microelectronic devices, methods of operating microelectronic devic...

Encapsulation mold with a castellated inner surface

Controlling packaging encapsulant leakage

Assembling a stacked die package

Compression layer on the leadframe to reduce stress defects

Non-continuous conductive layer for laminated substrates

Selectively coating bond pads

Test contact

Controlling packaging encapsulant leakage

Integrated circuit substrate having through hole markings to indica...

Patents Applicationslast 30 patents

METHODS OF OPERATING ELECTRONIC DEVICES, AND METHODS OF PROVIDING E...

METHODS OF OPERATING ELECTRONIC DEVICES, AND METHODS OF PROVIDING E...

Methods of Operating Electronic Devices, and Methods of Providing E...

METHOD OF FORMING A NON-CONTINUOUS CONDUCTIVE LAYER FOR LAMINATED S...

Methods of operating electronic devices, and methods of providing e...

Mold assembly, method and a package stack via bottom-leaded plastic...

Selectively coating bond pads

Mold assembly for a package stack via bottom-leaded plastic (BLP) p...

Methods of operating microelectronic devices, and methods of provid...

Method of forming a non-continuous conductive layer for laminated s...

Selectively coating bond pads

Solder ball landpad design to improve laminate performance

Solder ball landpad design to improve laminate performance

Methods of operating microelectronic devices, and methods of provid...

Package stack via bottom-leaded plastic (BLP) packaging

Method for assembling die package

Compression layer on the leadframe to reduce stress defects

Non-continuous conductive layer for laminated substrates

Apparatus and method for marking defective sections of laminate sub...

Method of forming a non-continuous conductive layer for laminated s...

SELECTIVELY COATING BOND PADS

Package stack via bottom leaded plastic (BLP) packaging

Controlling packaging encapsulant leakage

Assembling a stacked die package

Assembling a stacked die package

Selectively coating bond pads