Paul A. Drake

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Murrieta, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Eliminating interconnect strains in microcircuits
- Patent number 11,776,981
- Issue date Oct 3, 2023
- Raytheon Company
- Paul A. Drake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking to form a multi-wafer-bonded structure
- Patent number 10,475,664
- Issue date Nov 12, 2019
- Raytheon Company
- Andrew Cahill
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELIMINATING INTERCONNECT STRAINS IN MICROCIRCUITS
- Publication number 20230411427
- Publication date Dec 21, 2023
- Raytheon Company
- Paul A. Drake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELIMINATING INTERCONNECT STRAINS IN MICROCIRCUITS
- Publication number 20220157874
- Publication date May 19, 2022
- Raytheon Company
- Paul A. Drake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
- Publication number 20180096833
- Publication date Apr 5, 2018
- Raytheon Company
- Andrew Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING TO FORM A MULTI-WAFER-BONDED STRUCTURE
- Publication number 20180068843
- Publication date Mar 8, 2018
- Raytheon Company
- Andrew Cahill
- H01 - BASIC ELECTRIC ELEMENTS