Paul A. Lauro

Person

Brewster, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combination polyimide decal with a rigid mold
- Patent number 11,270,966
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile battery construct with engineered interfaces
- Patent number 11,183,725
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous solder transfer to substrates
- Patent number 11,110,534
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a gallium nitride device
- Patent number 10,892,333
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile battery construct with engineered interfaces
- Patent number 10,581,037
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a gallium nitride device
- Patent number 10,424,644
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective capping layer for spalled gallium nitride
- Patent number 10,249,792
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct injection molded solder process for forming solder bumps on...
- Patent number 10,147,694
- Issue date Dec 4, 2018
- GLOBALFOUNDRIES Inc.
- Bing Dang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for improving quality of spalled material layers
- Patent number 10,026,618
- Issue date Jul 17, 2018
- International Business Machines Corporation
- Stephen W. Bedell
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Simplified process for vertical LED manufacturing
- Patent number 10,020,418
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective capping layer for spalled gallium nitride
- Patent number 9,929,313
- Issue date Mar 27, 2018
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned metallization handle layer for controlled spalling
- Patent number 9,918,382
- Issue date Mar 13, 2018
- International Business Machines Corporation
- Turki bin Saud bin Mohammed Al-Saud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a gallium nitride device
- Patent number 9,748,353
- Issue date Aug 29, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating high-power devices
- Patent number 9,722,039
- Issue date Aug 1, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned metallization handle layer for controlled spalling
- Patent number 9,713,250
- Issue date Jul 18, 2017
- International Business Machines Corporation
- Turki bin Saud bin Mohammed Al-Saud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned metallization handle layer for controlled spalling
- Patent number 9,578,736
- Issue date Feb 21, 2017
- International Business Machines Corporation
- Turki bin Saud bin Mohammed Al-Saud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective capping layer for spalled gallium nitride
- Patent number 9,570,295
- Issue date Feb 14, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving quality of spalled material layers
- Patent number 9,564,335
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Substrate holder assembly for controlled layer transfer
- Patent number 9,502,278
- Issue date Nov 22, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Simplified process for vertical LED manufacturing
- Patent number 9,502,609
- Issue date Nov 22, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled spalling of fine features
- Patent number 9,455,180
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial probe structure of elongated electrical conductors projecti...
- Patent number 9,404,942
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Inc.
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method for improving surface quality of spalled substrates
- Patent number 9,308,714
- Issue date Apr 12, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- B32 - LAYERED PRODUCTS
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 9,295,166
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct injection molded solder process for forming solder bumps on...
- Patent number 9,273,408
- Issue date Mar 1, 2016
- GLOBALFOUNDRIES Inc.
- Bing Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving quality of spalled material layers
- Patent number 9,275,867
- Issue date Mar 1, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Self orienting micro plates of thermally conducting material as com...
- Patent number 9,263,363
- Issue date Feb 16, 2016
- GLOBALFOUNDRIES Inc.
- Gareth Hougham
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 9,095,081
- Issue date Jul 28, 2015
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromigration-resistant under-bump metallization of nickel-iron...
- Patent number 9,082,762
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Sung K. Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGULATING INDIVIDUAL CHIPS FROM WAFERS HAVING SMALL CHIPS AND SMA...
- Publication number 20220157657
- Publication date May 19, 2022
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD
- Publication number 20210151402
- Publication date May 20, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS SOLDER TRANSFER TO SUBSTRATES
- Publication number 20200316702
- Publication date Oct 8, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES
- Publication number 20200144564
- Publication date May 7, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A GALLIUM NITRIDE DEVICE
- Publication number 20190296113
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE CAPPING LAYER FOR SPALLED GALLIUM NITRIDE
- Publication number 20180047875
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
- Publication number 20170311436
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Turki bin Saud bin Mohammed Al-Saud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A GALLIUM NITRIDE DEVICE
- Publication number 20170294517
- Publication date Oct 12, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES
- Publication number 20170256759
- Publication date Sep 7, 2017
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE CAPPING LAYER FOR SPALLED GALLIUM NITRIDE
- Publication number 20170222090
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING HIGH-POWER DEVICES
- Publication number 20170194456
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A GALLIUM NITRIDE DEVICE
- Publication number 20170194449
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS
- Publication number 20170148635
- Publication date May 25, 2017
- International Business Machines Corporation
- Stephen W. Bedell
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Simplified Process for Vertical LED Manufacturing
- Publication number 20160284928
- Publication date Sep 29, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simplified Process for Vertical LED Manufacturing
- Publication number 20160284954
- Publication date Sep 29, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
- Publication number 20160183358
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Turki bin Saud bin Mohammed Al-Saud
- B32 - LAYERED PRODUCTS
Information Patent Application
PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING
- Publication number 20160183362
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Turki bin Saud bin Mohammed Al-Saud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS
- Publication number 20160163553
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON...
- Publication number 20160118358
- Publication date Apr 28, 2016
- GLOBALFOUNDRIES INC.
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20150195920
- Publication date Jul 9, 2015
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20150194408
- Publication date Jul 9, 2015
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS
- Publication number 20150140830
- Publication date May 21, 2015
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20140363965
- Publication date Dec 11, 2014
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HOLDER ASSEMBLY FOR CONTROLLED LAYER TRANSFER
- Publication number 20140312576
- Publication date Oct 23, 2014
- International Business Machines Corporation
- Stephen W. Bedell
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE HOLDER ASSEMBLY FOR CONTROLLED LAYER TRANSFER
- Publication number 20140312094
- Publication date Oct 23, 2014
- International Business Machines Corporation
- Stephen W. Bedell
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD FOR IMPROVING SURFACE QUALITY OF SPALLED SUBSTRATES
- Publication number 20140251548
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Stephen W. Bedell
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FACILITATING CRACK INITIATION DURING CONTROLLED SUBSTRAT...
- Publication number 20140242807
- Publication date Aug 28, 2014
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELEC...
- Publication number 20140191775
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
FIXED CURVATURE FORCE LOADING OF MECHANICALLY SPALLED FILMS
- Publication number 20140147988
- Publication date May 29, 2014
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS

Paul A. Lauro

Person

Patents Grantslast 30 patents

Ultrasonic-assisted solder transfer

Combination polyimide decal with a rigid mold

Low-profile battery construct with engineered interfaces

Continuous solder transfer to substrates

Method of making a gallium nitride device

Low-profile battery construct with engineered interfaces

Method of making a gallium nitride device

Protective capping layer for spalled gallium nitride

Direct injection molded solder process for forming solder bumps on...

Method for improving quality of spalled material layers

Simplified process for vertical LED manufacturing

Protective capping layer for spalled gallium nitride

Patterned metallization handle layer for controlled spalling

Method of making a gallium nitride device

Fabricating high-power devices

Patterned metallization handle layer for controlled spalling

Patterned metallization handle layer for controlled spalling

Protective capping layer for spalled gallium nitride

Method for improving quality of spalled material layers

Substrate holder assembly for controlled layer transfer

Simplified process for vertical LED manufacturing

Controlled spalling of fine features

Coaxial probe structure of elongated electrical conductors projecti...

Method for improving surface quality of spalled substrates

Double solder bumps on substrates for low temperature flip chip bon...

Direct injection molded solder process for forming solder bumps on...

Method for improving quality of spalled material layers

Self orienting micro plates of thermally conducting material as com...

Double solder bumps on substrates for low temperature flip chip bon...

Electromigration-resistant under-bump metallization of nickel-iron...

Patents Applicationslast 30 patents

SINGULATING INDIVIDUAL CHIPS FROM WAFERS HAVING SMALL CHIPS AND SMA...

ULTRASONIC-ASSISTED SOLDER TRANSFER

COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD

CONTINUOUS SOLDER TRANSFER TO SUBSTRATES

LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES

METHOD OF MAKING A GALLIUM NITRIDE DEVICE

PROTECTIVE CAPPING LAYER FOR SPALLED GALLIUM NITRIDE

PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING

METHOD OF MAKING A GALLIUM NITRIDE DEVICE

LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES

PROTECTIVE CAPPING LAYER FOR SPALLED GALLIUM NITRIDE

FABRICATING HIGH-POWER DEVICES

METHOD OF MAKING A GALLIUM NITRIDE DEVICE

METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS

Simplified Process for Vertical LED Manufacturing

Simplified Process for Vertical LED Manufacturing

PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING

PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING

METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS

DIRECT INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON...

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

SUBSTRATE HOLDER ASSEMBLY FOR CONTROLLED LAYER TRANSFER

SUBSTRATE HOLDER ASSEMBLY FOR CONTROLLED LAYER TRANSFER

METHOD FOR IMPROVING SURFACE QUALITY OF SPALLED SUBSTRATES

METHOD FOR FACILITATING CRACK INITIATION DURING CONTROLLED SUBSTRAT...

REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELEC...

FIXED CURVATURE FORCE LOADING OF MECHANICALLY SPALLED FILMS