Paul Armand Calo

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe, semiconductor package and method
- Patent number 12,218,038
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of soldering a semiconductor chip to a chip carrier
- Patent number 12,132,017
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure with radial spokes for improved s...
- Patent number 11,355,429
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor having a lidless/laminate structure
- Patent number 11,274,984
- Issue date Mar 15, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Power semiconductor package and method for fabricating a power semi...
- Patent number 11,211,356
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder barrier
- Patent number 9,640,459
- Issue date May 2, 2017
- Infineon Technologies AG
- Wee Boon Tay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SOLDERING A SEMICONDUCTOR CHIP TO A CHIP CARRIER
- Publication number 20240055376
- Publication date Feb 15, 2024
- INFINEON TECHNOLOGIES AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnect Structure with Radial Spokes for Improved S...
- Publication number 20210233839
- Publication date Jul 29, 2021
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package and Method for Fabricating a Power Semi...
- Publication number 20210057375
- Publication date Feb 25, 2021
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor
- Publication number 20210025774
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Application
Leadframe, Semiconductor Package and Method
- Publication number 20200051898
- Publication date Feb 13, 2020
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS