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Paul Armand Calo
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Cebu City, PH
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor die package and method for making the same
Patent number
8,497,164
Issue date
Jul 30, 2013
Fairchild Semiconductor Corporation
Armand Vincent C. Jereza
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die package and method for making the same
Patent number
8,222,718
Issue date
Jul 17, 2012
Fairchild Semiconductor Corporation
Armand Vincent C. Jereza
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for connecting a die attach pad to a lead frame and product...
Patent number
8,110,492
Issue date
Feb 7, 2012
Fairchild Semiconductor Corporation
Erwin Ian V. Almagro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for connecting a die attach pad to a lead frame and product...
Patent number
7,800,207
Issue date
Sep 21, 2010
Fairchild Semiconductor Corporation
Erwin Ian V. Almagro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wireless semiconductor package for efficient heat dissipation
Patent number
7,586,179
Issue date
Sep 8, 2009
Fairchild Semiconductor Corporation
Paul Armand Calo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Folded frame carrier for MOSFET BGA
Patent number
7,402,462
Issue date
Jul 22, 2008
Fairchild Semiconductor Corporation
Ruben P. Madrid
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
Publication number
20120329214
Publication date
Dec 27, 2012
Armand Vincent C. Jereza
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT...
Publication number
20100304534
Publication date
Dec 2, 2010
Erwin Ian V. Almagro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
Publication number
20100193921
Publication date
Aug 5, 2010
Armand Vincent C. Jereza
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT...
Publication number
20090102031
Publication date
Apr 23, 2009
Erwin Ian V. Almagro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRELESS SEMICONDUCTOR PACKAGE FOR EFFICIENT HEAT DISSIPATION
Publication number
20090091010
Publication date
Apr 9, 2009
Paul Armand Calo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Folded frame carrier for MOSFET BGA
Publication number
20070015316
Publication date
Jan 18, 2007
Ruben P. Madrid
H01 - BASIC ELECTRIC ELEMENTS